On the 13th, 17th and 18th of January 2011, IME hosted 60 students from Republic Polytechnic's School of Engineering and School of Applied Science. Currently pursuing diplomas in Micro and Nanotechnology, the students were treated to a tour of IME's Microsystems, Modules & Components (MMC) lab to give them a deeper understanding of how to package ICs - an area integral to the "Wafer Fabrication and Packaging" module that they are taking at the polytechnic.

Ms. Germaine Hoe and Mr. Myo Paing from MMC played host to the students over the course of the visits, providing in-depth explanations on advanced packaging techniques and conducting demonstrations whenever possible.

At the end of each visit, the feedback received from the students was the same - that they had gained a better understanding of the concepts espoused in their textbooks, enabling them to forge a stronger foundation in advanced packaging techniques.

Ms. Germaine Hoe explaining IME's advanced packaging techniques to the students.	Mr. Myo Paing showing the students IC chips that were designed and fabricated at IME.
The Republic Polytechnic students with their course facilitator Dr. Yang Hong (first from right).