Title
of Publication |
Author(s) |
Name of
Conference/Journal |
| Novel NiGe MSM Photodetector Featuring Asymmetrical Schottky Barriers using Sulfur Co-Implanatation and Segregation |
Kah-Wee Ang, Ming-Bin Yu, Shi-Yang Zhu, Khai-Tze Chua, Guo-Qiang Lo and Dim-Lee Kwong |
IEEE Electron Device Letters. Published in Vol. 29, No. 7, July 2008. |
| Novel Silicon-Carbon (Si:C) Schottky Barrier Enhancement Layer for Dark Current Suppression in Ge-on-SOI MSM Photodetectors |
K W Ang, S Y Zhu, J Wang, K T Chua, M B Yu, G Q Lo and D L Kwong |
IEEE Electron Device Letters. Published in Vol. 29, No. 7, July 2008. |
| Low-Power Short Range Radio CMOS Sub-Harmonic RF Front-end Using CG-CS LNA |
Teo Tee Hui and Yeoh Wooi Gan |
IEEE Transactions onCircuits and Systems II. Published as Express Briefs, Vol. 55, No. 7, July 2008. |
| Vertical Silicon Nanowire Formation and Gate-All-Around MOSFET |
B Yang, K D Buddharaju, S H G Teo, N Singh, G Q Lo and D L Kwong (IME) |
IEEE Electron Device Letters. Published in Vol. 29, No. 7, July 2008. |
| Ultraviolet and Visible Electroluminescence from n-ZnO/SiOx/(n+,p+)-Si Heterostructured Light-Emitting Diodes |
S T Tan, X W Sun (NTU), J L Zhaos (NTU), S Iwan (NTU), Z H Cen (NTU) and T P Chen (NTU), J D Ye, G Q Lo, D L Kwong and K L Teo (DSI) |
Applied Physics Letters. Published in 93, 013506 (2008). |
| Preparation of Nanochain and Nanosphere by Self-Asembly of gold Nanoparticles |
C Fang, Y Fan, J M Kong, Z Q Gao (IBN) and N Balasubramanian |
Applied Physics Letters. Published in 92, 263108 (2008). |
| Fabrication ofThick Germanium-on-Insulator (GeOI) Substrates |
S Balakumar, K M Hoe, G Q Lo, R Kumar, N Balasubramanian, Y L Foo (IMRE), S Tripathy (IMRE)and D L Kwong |
Journal of Electronic Materials. Published in Vol. 37, No. 7, July 2008. |
| Development and Characterization of High Aspect Ratio Silicon Etch Process for 3D-Microsystems |
N Ranganathan (IME/NTU), K Prasad (Auckland University of Technology), N Balasubramanian, S C Hwee, K L Pey (NTU) |
Journal of Micromechanics and Microengineering. Published pages 1 - 13 in 18 (2008) on 9 June 2008. |
| Ge Rich (70%) SiGe Nanowire MOSFET Fabricated Using Pattern Dependent Ge-Condensation Technique |
Y Jiang (IME/NUS), N singh (IME), T Y Liow (IME/NUS), W Y Loh, S Balakumar, K M Hoe, C H Tung, V Bliznetsov, S C Rustagi, G Q Lo, D S H Chan (NUS) and D L Kwong |
IEEE Electron Device Letters. Published in Vol. 29, No. 6, June 2008 |
| Performance Breakthrough in 8nm Gate Length Gate-all-Around Nanowire Transistors Using Metallic Nanowire Contacts |
Y Jiang (IME/NUS), T Y Liow (IME/NUS), N Singh, L H Tan, G Q Lo, D S H Chan (NUS) and D L Kwong |
2008 Symposium on VLSI Technology, 17 - 20 June 2008, USA. Published pages no. 34 - 35. |
| 5 nm Gate Length Nanowire-FETs and Planar UTB-FETs with Pure Germanium Source/Drain Stressors and Laser-Free Melt-Enhanced Dopant (MeltED) Diffusion and Activation Technique |
Tsung-Yang Liow (NUS/IME), Kian-Ming Tan (NUS), Rinus T P Lee (NUS), Ming Zhu (NUS), Ben L H Tan, Ganesh S Samudra (NUS), N Balasubramanian and Yee-Chia Yeo (NUS) |
2008 VLSI Technology Symposium, 17 - 20 June 2008, USA. Published pages no. 36 - 37. |
| A 90-nm CMOS LNA for MB-OFDM UWB in QFN Package |
King Wah Wong, M Annamalai Arasu and Wei Khuen Chan (Wipro Techno Centre) |
Radio Frequency Integrated Circuit Conference 2008, 15 - 17 June 2008, Atlanta, GA USA. Published pages no. 497 - 500. |
| Passive Ring-Assisted Mach-Zehnder Interleaver on Silicon-on-Insulator |
Junfeng Song (IME/Jilin University, China), Q Fang, S H Tao, M B Yu, G Q Lo and D L Kwong |
Optics Express. Published on 23 May 08 in Vol. 16, No. 12. |
| Development of Stretch Solder Interconnections for Wafer Level Packaging |
R Rajoo, E H Wong, S S Lim, W Y Hnin, Seah S K W , A A O Tay (NUS) and Mahadevan K Iyer (Georgia Institute of Technology) and Rao R Tummala (Georgia Institute of Technology) |
IEEE Transactions on Advanced Packaging. Published in vol. 31, No. 2, May 2008. |
| Effect of Wafer Back Grinding on the Mechanical Behaviour of Multilayered Black Diamond (low-k) Stack |
V N Sekhar, Lu Shen (IMRE), Aditya Kumar, T C Chai, Lee Wen Sheng Vincent, Zhang X W, C S Premchandran |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 1517 - 1524. |
| Impact of Packaging Design on Reliability of Large Die Cu/Low K (BD) Interconnect |
Chai T C, X W Zhang, H Y Li, V N Sekhar, Hnin W Y, Thew ML, OK Navas, R Murthy, S Balakumar, Tan Y M (IMRE), Cheng C K (SIMTech), S L Liew (IMRE) and Chi C Z (IMRE) |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 38 - 45. |
| Angled High Strain Rate Shear Testing of SnAgCu Solder Ball |
Chai T C, Yu D Q, John Lau, Zhu W H, X R Zhang (UTAC) |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no.623 - 628. |
| Nonlinear Thermal Stress and Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps |
Selvanayagam C S, Lau JH, Zhang XW, V Kripesh and T C Chai |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 1073 - 198. |
| Fabrication of Silicon Carriers with TSV Electrical Interconnections and Embedded Thermal Solutions for High Power 3-D Packages |
Aibin Yu, Navas Khan, Giridhar Archit (NTU), Kok Chuan Toh (NTU), V Kripesh, Seung Wook Yoon and John H Lau |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages 24 - 28. |
| Bi-Directional Optical Communication at 10 Gb/s on FR4 PCB Using Reflow solderable SMT Transceiver |
P V Ramana, Haridas Kuruveettil, Byan Lee Sik Pong, Tan Chee Wei, Jayakrishnan Chandrappan, Lim Teck Guan, Calvin Teo Wei Liang, Chai Yi Yoon, Kenji Suzuki (Mitsui), Tsiyoshi Shioda (Mitsui), Yap Guan Jie, Cheryl Dharmani, John Lau Hon-Shing |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 244 - 249. |
| Development of Low Temperature Bonding Using In-based Solders |
Won Kyoung Choi, Daquan Yu, Chenguo Lee (IME/NUS), Liling Yan), Aibin Yu, Seung Uk Yoon), John H Lau, Moon Gi Cho (Korea Advanced Institute of Science and Technology), Yoon Hwan Jo (Korea Advanced Institute of Science and Technology), and Hyuck Mo Lee (Korea Advanced Institute of Science and Technology) |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages 1294 - 1299. |
| A Hermetic Chip to Chip Bonding at Low Temperature with Cu/In/Sn/Cu Joint |
Liling Yan, Chenguo Lee (IME/NUS), Daquan Yu, Won Kyoung Choi, Aibin Yu , Seung Uk Yoonand John H Lau |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages 1844 - 1848. |
| Design and Development of a Multidie Embedded Wafer Level Package |
V Kripesh, Vempati Srivasa Rao, Zhang Xiaowu, Navas Khan, Lim Samuel, Ho Soon Wee, Khong Chee Houe, Khoo Yee Mong and John Lau |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 1544 - 1549. |
| High RF Performance TSV Silicon Carrier for High Frequency Application |
David Soon Wee Ho, Seung Wook Yoon, Q E Zhou (NTU), K Prasad (NTU), V Kripesh and John Lau |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 1946 - 1952. |
| Development of 3D silicon module with TSV for system in packaging |
Navas Khan, Vempati Srinivas Rao, Samule Lim, Ho Soon We, Vincent Lee, Zhang Xiao Wu, Yang Rui, Liao Ebin, Ranganathan N, Chai Tai Chong and V Kripesh |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 550 - 555. |
| A Novel Wafer Level Stacking Method for Low Yield and Non Uniform Chip Size Wafers for MEMS and 3D Packaging Applications |
C S Premachandra, Xie Ling and John Lau |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages 314 - 318. |
| Packaging Influence on a 3D MEMS Scanning Micromirror Based Optical Probe Imaging for Optical Coherence Tomography (OCT) Applications |
C S Premachandran, Ahmad Khairyanto, Kelvin Chen, Janak Singh (IME); Xu Yingshun, Chen Nanguang, Collin Sheppard (NUS) |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 829 - 833. |
| Optimization of a Microfluidic Packages for Lab On a Chip (LOC) Applications and Bio-Testing of DNA/RNA Extraction |
Ling Xie, C S Premachandran, Michelle Chew, Ser Choong Chong, Leong Ching Wai |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 1310 - 1316. |
| Optimization of Reliability of Copper-Low K Flip Chip Package with Variable Interconnect Compliance |
J M G Ong (NUS/CSM/IME), A A O Tay (NUS), Y K Lim, J B Tan (CSM), D K Sohn (CSM), X Zhang, V Kripesh |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages 1031 - 1035. |
| Integration of High Aspect Ratio Tapered Silicon Via for Through-Silicon Interconnection |
N Ranganathan, Liao Ebin, Linn Linn, Lee Wen Sheng Vincent, O K Navas, V Kripesh and N Balasubramanian |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 859 - 865. |
| High Performance Embedded RF Passive Device Process Integration |
H Y Li, Y M Khoo, Navas Khan, K W Teoh, Vempati Srinivasa Rao, H B Li, E B Liao, S Mohanraj, V Kripesh and K Rakesh |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 1709 - 1713. |
| Analysis of the Effects of Fringing Electric Field on FinFET Device Performance and Structural Optimization Using 3D Simulation |
Hui Zhao (NUS/IME), Yee-Chia Yeo (NUS), Subhash C Rustagi and Ganesh S Samudra (NUS) |
IEEE Transactions on Electron Devices. Published in Vol. 55, No. 5, May 2008. |
| Photonic Bandgap Crystal Resonator Enhanced, Laser Controlled Modulations of Optical Interconnects for Photonic Integrated Circuits |
Selin H G Teo, A Q Liu (NTU), J B Zhang (DSI), M H Hong (DSI), J Singh, M B Yu, N Singh and G Q Lo |
Optics Express. Published in Vol. 16, No. 11 on 16 May 2008. |
| A Universal UHF RFID Reader IC in 0.18 um CMOS Technology |
Pradeep B Khannur, Xuesong Chen, Dan Lei Yan, DanShen, Bin Zhao, M Kumarasamy Raja, Ye Wu, Rendra Sindunata, Wooi Gan Yeoh and Rajinder Singh |
IEEE Journal of Solid-State Circuits. Published in vol. 43, No. 5, May 2008. |
| Dual-Colour Electroluminescene+ce (λ450nm and 65-700nm) from a Silicon-based Light Source |
W K Tan, Q Chen, J D Ye, M B Yu, G Q Lo and D L Kwong |
IEEE Electron Device Letters. Published in Vol. 29, No. 4, April 2008. |
| Evanescent-Coupled Ge-PIN Photodetectors on Si-Waveguide with SEG-Ge and Comparative Study of Lateral and Vertical PIN Configurations |
J Wang (IME/NUS), W Y Loh, K T Chua, H Zang (IME/NUS), Y Z Xiong, T H Loh, M B Yu, S J Lee (NUS), G Q Lo and D L Kwong |
IEEE Transactions on Electron Devices. Published in vol. 29, No. 5, May 2008. |
| Si-Nanowire Based Gate-All-Around Non-Volatile SONOS Memory Cell |
J Fu (IME/NUS), N Singh, K D Buddharaju, S H G Teo, C Shen (NUS), Y Jiang (IME/NUS), C X Zhu (NUS), M B Yu, G Q Lo, N Balasubramanian, D L Kwong, E Gnani (ARCES, Unviersity of Bologna) and G Baccarani (ARCES, Unviersity) |
IEEE Electron Device Letters. Published in Vol. 29, No. 5, May 2008. |
| Dual-Colour Electroluminescene+ce (λ450nm and 65-700nm) from a Silicon-based Light Source |
W K Tan, Q Chen, J D Ye, M B Yu, G Q Lo and D L Kwong |
IEEE Electron Device Letters. Published in Vol. 29, No. 4, April 2008. |
| Low Loss (~6.45 dB/cm) sub-Micron Polycrystalline Silicon Waveguide Integrated with Efficient SiON Waveguide Coupler |
Q Fang, J F Song (IME/Jilin University, China), S H Tao, M B Yu, G Q Lo and D L Kwong |
Optics Express. Published on 22 Apr 08 in Vol. 16, No. 9. |
| High-Bendability Flexible Dye-Sensitized Solar Cell with a Nanoparticles-Modified ZnO-Nanowire Electrode |
C Y Jiang, X W Sun (IME/NTU), K W Tan , A K K Kyaw, G Q Lo and D L Kwong |
Applied Physics Letters. Published online in 7 April 2008 in 92, 142101 (2008) |
| A Wide Band Scalable and SPICE-Compatiable Model for On-Chip Interconnects Up to 110 GHz |
Kai Kang, Lan Nan (NUS), Subhash Chander Rustagi, Koen Mouthaan (NUS), Jinglin Shi, Rakesh Kumar, Wen-Yan Yin (Shanghai Jiao Tong University) |
IEEE Trans. Microwave Theory and Techniques. Published in vol. 56, No. 4, April 08. |
| A Disposable Magnetic Planar Peristaltic Pump for a Self-Contained Fully Enclosed Lab on a Chip Cartridge |
Levent Yobas, Lih Feng Cheow, Kum-Cheong Tang, Shien-Eit Yong, Eleana Kye-Zheng Ong, Lionel Wong, William Cheng-Yong Teo, Hongmiao Ji, Siti Rafeah and Chen Yu |
Lab on a Chip. Published in 2008, 8, 660 - 662. |
| Time Constant Based CMOS Readout Circuit for DNA Detection |
T Hui Teo, Kar-Liang Oung (IME Technical University of Munich/NTU), Xian Tong Chen, Zhi Qiang Gao, Yi Fan and Wooi Gan Yeoh |
Electronics Letters. Published on 13 Mar 08 in Vol. 44, No. 6. |
| Strained n-MOSFET with Embedded Source/Drain Stressors and Strain-Transfer Structure (STS) for Enhanced Transistor Performance |
Kah-Wee Ang (NUS/IME), Jianqiang Lin (NUS), Chih-Hang Tung, N Balasubramanian, Ganesh S Samudra (NUS) and Yee-Chia Yeo (NUS) |
IEEE Transactions on Electron Devices. Published in vol. 55, No. 3, March 2008. |
| A More Comprehensive Solution for Tri-Material Layers Subjected to Thermal Stress |
E H Wong and Thiam Beng Lim |
IEEE Transactions on Components and Packaging Technologies. Published in vol. 31, No. 1, March 2008, pages 54 - 64. |
| Thin Amorphous Si/Si3N4 Based Light-Emitting Device Prepared with Low Thermal-Budget |
W K Tan, M B Yu, Q Chen, W Y Lo, J D Ye, X H Zhang (IMRE), G Q Lo and D L Kwong |
IEEE Electronics Device Letters. Published in vol. 29, No. 3, March 2008. |
| Stress-Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modelling |
E H Wong, C S Selvanayagam, S K W Seah, W D van Driel (NXP Semiconductors), J F J M Caers (Philips Applied Technologies), X J Zhao (Philips Applied Technologies), N Owens (Freescale Semiconductors), Y S Lai (Central Labs, ASE) and C L Yeh (CenralLabs, ASE) |
Journal of Electronic Materials. Published in vol. 37, No. 6, 2008. |
| Near-Infrared Waveguide-Based Nickel Silicide Schottky-Barrier Photodetector for Optical Communications |
Shiyang Zhu, M B Yu, G Q Lo and D L Kwong |
Applied Physics Letters. Published in 92, 081103 (2008). |
| A 0.18µm CMOS 802.15.4a Compliant UWB Transceiver for Communication and Localization |
Yuanjin Zheng, M Annamalai Arasu, King-Wah Wong, Yen Ju The, Andrew Poh, Duy Duong Tran, Wooi Gan, Dim-Lee Kwong |
ISSCC 2008, 3 - 8 Feb 2008, San Francisco, USA. |
| Highly Sensititve Measurements of PNA-DNA Hybridization Using Oixde-Etched Silicon Nanowire Biosensors |
Guo-Jun Zhang, Huiyi Jay Chua, Ru-Ern Chee, Ajay Agarwal, She Mein Wong, Kavitha D Ruddharaju and N Balasubramanian |
Biosensors and Bioelectronics. Published in 23 (2008) 1701 - 1707. |
| 150um Pitch Cu/Low-k Flipchip Packaging with PEDL (Polymer Encapsulated Dicing Line) and Cu Column Interconnects |
Seung Wook Yoon, Serene Meei Ling Thew), Samuel Yak Long Lim, Wai Ynn Hnin, Tai Chong Chai, Akella G K Viswanath (IHPC) and Vaidyanathan Kripesh |
IEEE Transactions on Advanced Packaging. Published in Vol. 31, No. 1, February 2008. |
| Reliability of a Silicon Stacked Module for 3D SiP Microsystem |
Seung Wook Yoon, Samuel Yak Long Lim, Akella G K Viswanath (IHPC), Serene Thew Tai Chong Chai and Vaidyanathan Kripesh |
IEEE Transactions on Advanced Packaging. Published in Vol. 41, No. 1, February 2008. |
| Development of 3D Stack Package Using Silicon Interposer for High Power Application |
Navas Khan, S W Yoon, Akella G K Viswanath (IHPC), V P Ganesh, Ranganathan N, David Witarsa (Atotech SEA Ltd), Samuel Lim and V Kripesh |
IEEE Transactions Advanced Packaging. Published in Vol. 31, No. 1, February 2008. |
| Application of Dopant Segregation to Metal-Germanium-Metal Photodetectors and its Dark Current Suppression Mechanism |
H Zang (IME/NUS), W Y Loh, J Wang (IME/NUS), M B Yu, G Q Lo, D L Kwong, S J Lee (NUS) and B J Cho (NUS) |
Applied Physics Letters. Published in 92, 051110 (2008). |
| Dark-Current Suppression in Metal-Germanium-Metal Photodetectors Through Dopant-Segregationin NiGe-Schottky Barrier |
H Zang (IME/NUS), S J Lee (NUS), W Y Loh, J Wang IME/NUS), K T Chua, M B Yu, B J Cho (NUS), G Q Lo and D L Kwong |
IEEE Electron Device Letters. Published in Vol. 29, No. 2, February 2008. |
| Rigorous Surface-Potential Solution for Undoped Symmetric Double-Gate MOSFETs Considering Both Electrons and Holes |
Z M Zhu (NTU/IME), X Zhou (NTU), S C Rustagi , G H See(NTU),S H Lin (NTU), C Q Wei (NTU), G J Zhu (NTU), G H Lim (NTU) |
IEEE Trans. On Electron Devices. Published in Vol. 55, No. 2, February 2008. |
| Real-time Monitoring Approach: Assessment of Effects of Antibodies on the Adhesion of NCI-H460 Cancer Cells to the Extracellular Matrix |
Yu Chen, Juntao Zhang (NTU), Li Zhang, Rebound Julien, Kumcheong Tang and N Balasubramanian |
Biosensors and Bioelectronics. Published in 23 (2008) 1390 - 1396. |
| Design and Fabrication of a Line-Defect Bend Sandwiched with Air Trenches in a Photonic Crystal Platform |
S H Tao, M B Yu, J F Song, R Yang, G Q Lo and D L Kwong |
Applied Physics Letters. Published in 92, 031113 (2008) |
| Degradation of Low-Frequency Noise in SiGe/SiGeC Surface Channel p-type MOSFET Due to Consuming os Si-Cap |
R Yang, Y Z Xiong, W Y Loh, J D Ye, M B Yu, C Shen (IME/NUS), J J Yang (IME/NUS), K T Chua, K M Hoe, G Q Lo, N Balasubramanian and D L Kwong |
Applied Physics Letters. Published in 91, 233505 (2007). |
