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Selected Publications
ICS Publication | MMC Publication | SPT Publication | Bioelectronics Publication | NanoEP Publication | SAM Publication | MDRA Publication | THz Publication | TSV Publication | MMD Publication
Title
of Publication |
Author(s) |
Name of
Journal |
Published Paper |
| 3D Interconnection Process Development and Integration with Low Stress TSV |
T T Chua, S W Ho, H Y Li, E B Liao, C H Khong, E B Liao, SP Chew , W S Lee, L S Lim, X F Pang, S L Kriangsak (UTAC), Catherine Ng (UTAC), S Nathapong (UTAC), C H Toh (UTAC), |
ECTC 2010, 1 - 4 June 2010, Las Vegas, USA. Published pages no. 798 - 802. |
|
| Three Chips Stacking with Low Volume Solder Using Single Re-Flow Process |
Navas Khan, S W Ho, Joe Ong, Cheryl Sharmani, Li Shiah Lim, H Y Li, Shekar Vasarala |
Electronic Components and Technology Conference 2010, 1 - 4 June 2010, Las Vegas, USA. Published pages 884 - 888. |
|
| Characterization and Management of Wafer Stress for Various Pattern Densities in 3D Integration Technology |
X F Pang, T T Chua, H Y Li, E B Liao, W S Lee F X Che |
ECTC 2010, 1 - 4 June 2010, Las Vegas, USA. Published pages no. 1866 - 1869 |
|
| Fast Electroplating TSV Process Development for the Via-Last Approach |
Hongyu Li, Ebin Liao, Xue Fang Pang, Han Yu (Shanghai Sinyang Semiconductor Materials Co., Ltd), Ltd), Xin Xin Yu (Shanghai Sinyang Semiconductor Materials Co., Ltd) and Jan Yan Sun (Shanghai Sinyang |
ECTC 2010, 1 - 4 June 2010, Las Vegas, USA. Published pages 777 - 779. |
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