Title
of Publication |
Author(s) |
Name of
Journal |
| Implementation of Packaged Integrated Antenna with Embedded Front End for Bluetooth Applications |
Rotaru Mihai (IME/University of Southampton, UK), Lim Ying Ying, Haridas Kuruveettil , Yang Rui, Popov P Alexander (NUS) and Chua Chee Parng (Perlos Asia) |
IEEE Transaction on Advanced Packaging. Published in IEEE Adv Packaging, Vol 31,No 3,2008. |
| Effect of Wafer Back Grinding on the Mechanical Behaviour of Multilayered Black Diamond (low-k) Stack |
V N Sekhar, Lu Shen (IMRE), Aditya Kumar, T C Chai, Lee Wen Sheng Vincent, Zhang X W, C S Premchandran |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 1517 - 1524. |
| Impact of Packaging Design on Reliability of Large Die Cu/Low K (BD) Interconnect |
Chai T C, X W Zhang, H Y Li, V N Sekhar, Hnin W Y, Thew ML, OK Navas, R Murthy, S Balakumar, Tan Y M (IMRE), Cheng C K (SIMTech), S L Liew (IMRE) and Chi C Z (IMRE) |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 38 - 45. |
| Angled High Strain Rate Shear Testing of SnAgCu Solder Ball |
Chai T C, Yu D Q, John Lau, Zhu W H, X R Zhang (UTAC) |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no.623 - 628. |
| Nonlinear Thermal Stress and Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps |
Selvanayagam C S, Lau JH, Zhang XW, V Kripesh and T C Chai |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 1073 - 198. |
| Fabrication of Silicon Carriers with TSV Electrical Interconnections and Embedded Thermal Solutions for High Power 3-D Packages |
Aibin Yu, Navas Khan, Giridhar Archit (NTU), Kok Chuan Toh (NTU), V Kripesh, Seung Wook Yoon and John H Lau |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages 24 - 28. |
| Bi-Directional Optical Communication at 10 Gb/s on FR4 PCB Using Reflow solderable SMT Transceiver |
P V Ramana, Haridas Kuruveettil, Byan Lee Sik Pong, Tan Chee Wei, Jayakrishnan Chandrappan, Lim Teck Guan, Calvin Teo Wei Liang, Chai Yi Yoon, Kenji Suzuki (Mitsui), Tsiyoshi Shioda (Mitsui), Yap Guan Jie, Cheryl Dharmani, John Lau Hon-Shing |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 244 - 249. |
| Development of Low Temperature Bonding Using In-based Solders |
Won Kyoung Choi, Daquan Yu, Chenguo Lee (IME/NUS), Liling Yan), Aibin Yu, Seung Uk Yoon), John H Lau, Moon Gi Cho (Korea Advanced Institute of Science and Technology), Yoon Hwan Jo (Korea Advanced Institute of Science and Technology), and Hyuck Mo Lee (Korea Advanced Institute of Science and Technology) |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages 1294 - 1299. |
| A Hermetic Chip to Chip Bonding at Low Temperature with Cu/In/Sn/Cu Joint |
Liling Yan, Chenguo Lee (IME/NUS), Daquan Yu, Won Kyoung Choi, Aibin Yu , Seung Uk Yoonand John H Lau |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages 1844 - 1848. |
| Design and Development of a Multidie Embedded Wafer Level Package |
V Kripesh, Vempati Srivasa Rao, Zhang Xiaowu, Navas Khan, Lim Samuel, Ho Soon Wee, Khong Chee Houe, Khoo Yee Mong and John Lau |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 1544 - 1549. |
| High RF Performance TSV Silicon Carrier for High Frequency Application |
David Soon Wee Ho, Seung Wook Yoon, Q E Zhou (NTU), K Prasad (NTU), V Kripesh and John Lau |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 1946 - 1952. |
| Development of 3D silicon module with TSV for system in packaging |
Navas Khan, Vempati Srinivas Rao, Samule Lim, Ho Soon We, Vincent Lee, Zhang Xiao Wu, Yang Rui, Liao Ebin, Ranganathan N, Chai Tai Chong and V Kripesh |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 550 - 555. |
| A Novel Wafer Level Stacking Method for Low Yield and Non Uniform Chip Size Wafers for MEMS and 3D Packaging Applications |
C S Premachandra, Xie Ling and John Lau |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages 314 - 318. |
| Packaging Influence on a 3D MEMS Scanning Micromirror Based Optical Probe Imaging for Optical Coherence Tomography (OCT) Applications |
C S Premachandran, Ahmad Khairyanto, Kelvin Chen, Janak Singh (IME); Xu Yingshun, Chen Nanguang, Collin Sheppard (NUS) |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 829 - 833. |
| Optimization of a Microfluidic Packages for Lab On a Chip (LOC) Applications and Bio-Testing of DNA/RNA Extraction |
Ling Xie, C S Premachandran, Michelle Chew, Ser Choong Chong, Leong Ching Wai |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 1310 - 1316. |
| Optimization of Reliability of Copper-Low K Flip Chip Package with Variable Interconnect Compliance |
J M G Ong (NUS/CSM/IME), A A O Tay (NUS), Y K Lim, J B Tan (CSM), D K Sohn (CSM), X Zhang, V Kripesh |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages 1031 - 1035. |
| Development of Stretch Solder Interconnections for Wafer Level Packaging |
R Rajoo, E H Wong, S S Lim, W Y Hnin, Seah S K W , A A O Tay (NUS) and Mahadevan K Iyer (Georgia Institute of Technology) and Rao R Tummala (Georgia Institute of Technology) |
IEEE Transactions on Advanced Packaging. Published in vol. 31, No. 2, May 2008. |
| Stress-Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modelling |
E H Wong, C S Selvanayagam, S K W Seah, W D van Driel (NXP Semiconductors), J F J M Caers (Philips Applied Technologies), X J Zhao (Philips Applied Technologies), N Owens (Freescale Semiconductors), Y S Lai (Central Labs, ASE) and C L Yeh (CenralLabs, ASE) |
Journal of Electronic Materials. Published in vol. 37, No. 6, 2008. |
| Development of Stretch Solder Interconnections for Wafer Level Packaging |
R Rajoo, E H Wong, S S Lim, W Y Hnin, Seah S K W , A A O Tay (NUS) and Mahadevan K Iyer (Georgia Institute of Technology) and Rao R Tummala (Georgia Institute of Technology) |
IEEE Transactions on Advanced Packaging. Published in vol. 31, No. 2, May 2008. |
| Stress-Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modelling |
E H Wong, C S Selvanayagam, S K W Seah, W D van Driel (NXP Semiconductors), J F J M Caers (Philips Applied Technologies), X J Zhao (Philips Applied Technologies), N Owens (Freescale Semiconductors), Y S Lai (Central Labs, ASE) and C L Yeh (CenralLabs, ASE) |
Journal of Electronic Materials. Published in vol. 37, No. 6, 2008. |
| A More Comprehensive Solution for Tri-Material Layers Subjected to Thermal Stress |
E H Wong and Thiam Beng Lim |
IEEE Transactions on Components and Packaging Technologies. Published in vol. 31, No. 1, March 2008, pages 54 - 64. |
| 150um Pitch Cu/Low-k Flipchip Packaging with PEDL (Polymer Encapsulated Dicing Line) and Cu Column Interconnects |
Seung Wook Yoon, Serene Meei Ling Thew), Samuel Yak Long Lim, Wai Ynn Hnin, Tai Chong Chai, Akella G K Viswanath (IHPC) and Vaidyanathan Kripesh |
IEEE Transactions on Advanced Packaging. Published in Vol. 31, No. 1, February 2008. |
| Reliability of a Silicon Stacked Module for 3D SiP Microsystem |
Seung Wook Yoon, Samuel Yak Long Lim, Akella G K Viswanath (IHPC), Serene Thew Tai Chong Chai and Vaidyanathan Kripesh |
IEEE Transactions on Advanced Packaging. Published in Vol. 41, No. 1, February 2008. |
| Development of 3D Stack Package Using Silicon Interposer for High Power Application |
Navas Khan, S W Yoon, Akella G K Viswanath (IHPC), V P Ganesh, Ranganathan N, David Witarsa (Atotech SEA Ltd), Samuel Lim and V Kripesh |
IEEE Transactions Advanced Packaging. Published in Vol. 31, No. 1, February 2008. |
| Study of Ag-In Solder as Low Temperature Wafer Bonding Intermediate Layer |
I Made Riko (IME/NTU), Chee Lip Gan (NTU), Chengkuo Lee (IME/NUS), Li Ying Yan, Aibin Yu, Seung Uk Yoonand John H Lau |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Development of Wafer Level Packaged Scanning Micromirrors |
Aibin Yu, Chengkuo Lee (IME/NUS), Li Ling Yan, Qing Xin Zhang, Seung Uk Yoon, John H Lau and Chengkuo Lee (IME/NUS) |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| 3.125Gbps Multi Channel Electrical Transmission Line Design for CWDM |
Lim Teck Guan, Khoo Yee Mong, Li Jing, Chai Yi Yoon, Tan Chee Wei, P V Ramana, John Lau Hon Shing; Seiji Maruo (Hitachi Cable Ltd, Japan) |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Development of a Low Cost 2.5 Gbps SFF Optical Transceiver using 0.18 um CMOS ICs |
Chai Yi Yoon, Zhang Jing, P V Ramana, Yap Guan Jie, John Lau Hon-Shing |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Taper Couplers for Effective Coupling Between Laser and Silicon Waveguide with Large Allowable Tolerance |
Zhang Jing, Li Bihan (IME/NUS), Jayakrishnan Chandrappan, Zhang Qing Xin, P V Ramana, Patinharekandy Prabhattan (NTU), John Lau, Kwong Dim Lee and Murukeshan Vadakke matham (NTU) |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Optical Design of a Miniature Semi-Integrated Tunable Laser on a Silicon Optical Bench |
P V Ramana, Li Jing, Jayakrishnan Chandrappan, Lim Teck Guan, Zhang Jing, John Lau Hon Shing and Dim Lee Kwong |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Design and Analysis of 3D Stacked Optoelectronics on Optical Printed Circuit Boards |
John Lau, Lim Ying Ying, Lim Teck Guan, Tang Gong Yue, Khong Chee Houe, Xiaowu Zhang, P V Ramana, Zhang Jing, Tan Chee Wei, Jayakrishnan Chandrappan, Joey Chai Yi Yoon, Li Jing, Tangdiongga Geri Endrio and Kwong Dim Lee |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Optical Design of 4-channel TOSA/ROSA for CWDM Applications |
G Tangdiongga, Lim Teck Guan, Jing Li , Tan Chee Wei, P V Ramana , Chai Yi Yoon, Seiji Mauro (Hitachi Cable Ltd) and John Lau Hon-Shing |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| A Biocompatible Miniaturized Package Housing for a 3D Micromirror Based Optical Bioprobe for OCT Imaging Application |
C S Premachandran, Ahmad Khairyanto, Kelvin Chen and Janak Singh |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| A Novel Approach on Fluid Dispensing for a DNA/RNA Extraction Chip Package |
Ling Xie, C S Premachandran , Michelle Chew, Qiang Yao (IHPC), Diao Xu (IHPC) and D Pinjala |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Assembly of Optical MUX/DEMUX on Silicon Optical Bench with High Placement Accuracies |
Tan Chee Wei, Lim Teck Guan, Li Jing, Tangdiongga Geri Endrio, Chai Yi Yoon, Seiji Maruo (Hitachi Cable Ltd), P V Ramana and John H Lau |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Cost Effective Optical Coupling for Enhanced Data Rate POF Communications |
Jayakrishnan Chandrappan, Zhang Jing, Xiao Yongfei, P V Ramana, John Lau Hon Shing and Dim Kwong |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Design and Modeling of Nanophotonic Beam Structures as Optical NEMS Sensors |
Chengkuo Lee (IME/NUS), Jayaraj Thillaigovindan (NUS), Aibin Yu (IME), Rohit Radhakrishnan (NUS), Chii-Chang Chen (NUS), Ta-Ting Chao (Yuan Ze University, Taiwan) and John H Lau |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Cost Effective Optical Coupling for Polymer Optical Fiber Communication |
Jayakrishnan Chandrappan, Zhang Jing, Ramkumar V Mohan (NUS), Philbert Oliver Gomez (NTU), Than Aye Aung (ngee Ann Polytechnic), Xiao Yongfei (NUS), P V Ramana, John Lau and Dim Lee Kwong |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Design of A Bidirectional WDM Module for WDM Multi-channel Transceivers |
Zhang Jing, Lim Teck Guan, Li Jing, P V Ramana, V M Ramkumar (NUS), D Pinjala, John Lau and Kwong Dim Lee |
SPIE APOC 2007, 1 - 5 Nov 2007, China Wuhan |
| Design of Taper Coupler for Effective Laser and ingle Mode Fiber Coupling with Large Tolerance |
Zhang Jin, P V Ramana, John Lau, Zhang Qingxin, Jayakrishnan Chandrappan, Tan Chee Wei, Jong Ming Chinq, Calvin eo Wei Liang and Dim Lee Kwong |
SPIE APOC 2007, 1 - 5 Nov 2007, China Wuhan |
| Synthesis and Characterization of Patterned and Non-Patterned Copper and Nickel Nanowire Arays on Silicon Substrate |
Gaurav Sharma, Vaidyanathan Kripesh, Mong Chea Sim (NUS) and Chorng Haur Sow (NUS) |
Sensors and Actuators A - Physical. Published in A 139 (2007) 272 - 280. |
| Demonstration of High Frequency Data Link on FR4 PCB Using Optical Waveguides |
Teck Guan Lim, Bryan Sik Pong Lee, Tsuyoshi Shioda (Mitsui), Haridas Kuruveettil (Mitsui), Jing Li (Mitsui), Kenji Suzuki (Mitsui), Kazuhito Fujita (Mitsui), Kazuhiro Yamada (Mitsui) and P V Ramana |
Electronic Components & Technology Conference, May 29 - June 1, 2007 |
| Design, Integration and Testing of Fluidic Dispensing Control Valve into a DNA/RNA Sample Preparation Microfluidic Package for Point of Care Applications |
Ling Xie, C S Premachandran, Ser Choong Chong and Michelle Chew |
Electronic Components & Technology Conference, May 29 - June 1, 2007 |
| Large Scale Micro-Components Assembly Using an External Magnetic Array |
Qasem Ramadan, Yoon Seung Uk and Kripesh Vaidyanathan |
Applied Physics Letters. Published in 90, 172502 (2007). |
