Title
of Publication |
Author(s) |
Name of
Journal |
| Influence of Bosch Etch Process on electrical Isolation of TSV Structures |
N Ranganathan, D Y Lee, Liu Youhe, G Q Lo, K Prasad (NTU) and K L Pey (NTU) |
IEEE Transactions on Components, Packaging and Manufacturing Technology. Published in vol. 1, No. 18, Oct 2011, Published pages 1497- 1507. |
| A High-Speed Electrostatic Double-Layered Vibratory Grating Scanner With Very High Optical Resolution |
Yu Du (NUS/IME), Guangya Zhou (NUS), Kelvin K L Cheo (NUS), Qingxin Zhang, Hanhua Feng, Gook Siong Chau (NUS) |
Transducers 2011, 5 - 9 June 2011, Beijing China. Published pages no. 2546 - 2549. |
| A Novel MEMS Configuration for Three Dimensional Fine Positioning and Mechanical Fixing of a Ball Lens in the Packaging of Silicon Photonics |
Q X Zhang, Y Du (IME/NUS), C W Tan, J Zhang, M B Yu, G Q Lo, D L Kwong |
Transducers 2011, 5 - 9 June 2011, Beijing China. Published pages no. 1795 - 1798. |
| High Throughput Anistotropic Plasma Etching Polyimide for MEMS |
V N Bliznetsov, A Manickam, J W Chen (NTU), N Ranganathan |
Journal of Micromecics and Microengineering. Published on 11 May 2011, 21 (2011). |
| A High Speed MEMS Grating Laser Scanner with a Backside Thinned Grating Platform Fabricated Using Single Mask Delay Etching (SMDE) Technique |
Yu Du (NUS/IME), Guangya Zhou (NUS), Kelvin Koon Lin Cheo (NUS), Qingxin Zhang, Hanhua Feng, Fook Siong Chau (NUS) |
Journal of Micromechanics and Microengineering. Published in 20 (2010), 115028 (11 pp) on 18 Oct 10. |
| A Micromachined Electrostatic Double Layer Vibratory Grating Scanner for High Speed, High Resolution Laser Scanning |
Yu Du (NUS/IME), Guangya Zhou (NUS), Koon Lin Cheo (NUS), Qingxin Zhang, Hanhua Feng, Fook Song Chau (NUS) |
Journal of Microelectromechanical Systems. Published in vol. 19, No. 5, October 2010. |
| A Two Wafer Approach for Integration of Optical MEMS and Photonics on Silicon Substrate |
Q X Zhang, J Zhang, M B Yu, Chee Wei Tan, G Q Lo and D L Kwong |
IEEE Photonics Technology Letters. Published in Vol. 22, No. 5, 1 March 2010. |
| A Silicon Platofrm with MEMS Active Alighment Function and its Potential Application in Si-Photonics Packaging |
Q X Zhang, Y Du, C W Tan, J Zhang, M B Yu, WG Yeoh, G Q Lo and D L Kwong |
IEEE Journal of Selected Topics in Quantum Electronics. Published in Vol. 16, No. 1, January/February 2010. |
| A 2-DOF Circular Resonator Driven In-Plane Vibratory Grating Laser Scanner |
Yu Du (NUS/IME), Guangya Zhou (NUS), Koon Lin Cheo (NUS), Qingxin Zhang, Hanhua Feng and Fook Siong Chau (NUS) |
IEEE Journal of Microelectromechanical Systems. Published in vol. 18, No. 4, August 2009. |
| Development of Tapered Silicon Micro-Micromachining Process for 3-D Microsystems Packaging |
N Ranganathan (IME/NTU), L Dayong, L Ebin, N Balasubramanian, K Prasad (Auckland University of Technology), K L Pey (NTU) |
Journal of Micromechanics and Microengineering. Published in 18 (2008) on 15 Oct 08. |
| Integration of RF MEMS and CMOS IC on Printed Circuit Board for A Compact RF System Application Based on Wafer Transfer |
Q X Zhang, A B Yue, R Yang, H Y Li, L H Guo, E B Liao, M Tang, G Q Lo, N Balasubramanian and D L Kwong |
IEEE Transaction on Electron Devices. Published in vol. 55, No. 9, September 2008, pages 2484 - 2491. |
| A 2-DOF Circular-Resonator-Driven In-Plane Vibratory Grating Laser Scanner |
Yu Du, Guangya Zhou, Koon Lin Cheo, Qingxin Zhang, Hanhua Feng, and Fook Siong Chau |
Journal Of Micromechanical Systems. Published in Vol: 18 Issue: 4 Pages: 892-904 Published: Aug 2009 |
| Development and Characterization of High Aspect Ratio Silicon Etch Process for 3D-Microsystems |
N Ranganathan (IME/NTU), K Prasad (Auckland University of Technology), N Balasubramanian, S C Hwee, K L Pey (NTU) |
Journal of Micromechanics and Microengineering. Published pages 1 - 13 in 18 (2008) on 9 June 2008. |
| Integration of High Aspect Ratio Tapered Silicon Via for Through-Silicon Interconnection |
N Ranganathan, Liao Ebin, Linn Linn, Lee Wen Sheng Vincent, O K Navas, V Kripesh and N Balasubramanian |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 859 - 865. |
| Novel Integration of Metal-Insulator-Metal (MIM) Capacitors Comprising Perovskite-Type Dielectric and Cu Bottom Electrode on Low-Temperature Packaging Substrates |
E B Liao, T H Choong (NTU), W G Zhu (NTU), KW Teo, P C Lim (IMRE), G Q Lo and D L Kwong |
IEEE Electronic Device Letters. Published in Vol. 29, No. 1, January 2008. |
| RF, DC, and Reliability Performance of Embedded MIM Capacitors on Organic Substrates for System-on-Package Applications |
E B Liao, H Y Li, L H Guo, R Kumar, G Q Lo, N Balasubramanian and D L Kwong |
IEEE Transaction on Electron Devices. Published in Vol. 54, No. 3, March 2007. |
