Title
of Publication |
Author(s) |
Name of
Journal |
| A Low Stress Bond Pad Design Optimization of
Low Temperature Solder Interconnections on TSVs for MEMS
Applciations |
Xiaowu Zhang, Ranjan Rajoo, F X Che, Cheryl S
Selvanayagam, W K Choi, Shan Gao, D Pinjala, D L Kwong |
IEEE International 3D System Integration
Conference 2011 (3DIC 2011), 31 Jan to 2 Feb 2012, Osaka, Japan.
Published in session P-1-35. |
| Ultra-Compact Micro-Coil Realized Via
Multi-Level Dense TSV Coil for MEMs Application |
H Y Li, L Xie, L G Ong, A Baram (Maradin
Technologies Ltd), Armon Hirshberg (Maradin Technologies Ltd), S
C Chong, D L Kwong |
IEEE International 3D System Integration
Conference 2011 (3DIC 2011), 31 Jan to 2 Feb 2012, Osaka, Japan.
Published in session P-1-34. |
| Numerical and Experimental Study on Copper
Protrusion of Cu-Filled Through- Silicon Vias |
F X Che, W N Putra (IME/NTU), A Heryanto
(IME/NTU), A Trigg, S Gao, C L Gan (NTU) |
IEEE International 3D System Integration
Conference 2011 (3DIC 2011), 31 Jan to 2 Feb 2012, Osaka, Japan.
Published in session P-1-13. |
| Interconnect Design and Analysis for Through
Silicon Interposers (TSIs) |
Joseph Romen Cubillo, Roshan Weerasekera, Zaw
Zaw Oo (IHPC), En-Xiao Liu (IHPC), Bob conn (IHPC), Surya
Bhattacharya, Robert Patti (Terrazron Semiconductors) |
IEEE International 3D System Integration
Conference 2011 (3DIC 2011), 31 Jan to 2 Feb 2012, Osaka, Japan.
Published in session P-1-35. |
| Study on the Effect of Wafer Back Grinding Process on Nanomechanical Behaviour of Multilayered Low-k Stack |
V N Sekhar, Lu Shen (IMRE), Aditya Kumar, T C Chai, Xiaowu Zhang, C S Premchandran, V Kripesh, Seung Wook Yoon, Jonh H Lau |
IEEE Transactions on Components and Packaging Technologies changed to IEEE Transactions on Components, Packaging and Manufacturing Technology. Published in Vol. 2, No. 1, Jan 2012, pages 3 - 11. |
| Process and Reliability of Embedded Micro Wafer Level Package (EMWLP) using Low Cure Temperature Dielectric Material |
Vermpati Srinivas Rao, Vasarla Nagendra Sekhar, Nandar Su, Ho Soon Wee, Ranjan Ranjoo, Gaurav Sharma, Lim Ying Ying, Aditya Kumar, Pinjala Damaruganath |
IEEE Transactions on Components, Packaging and Manufacturing Technology. Published in vol. 2, No. 1, Jan 2012, pages 13 - 21. |
| The Compatibility of Dielectric Passvation and Temporary Bonding Materials for Thin Wafer Handling in 3D TSV Integration |
Jaesik Lee, Justin Seetoh, Hong Yu Li, Vincent Lee, Yen Chen Yeo, Guan Kian Lau, Keng Hwa Teo, Shan Gao |
IEEE Transaction on Components, Packaging and Manufacturing Technology. Published in Vol. 1, No. 12, December 2011, pages 1988 - 1995. |
| Spatial Variation of TSV Capacitance and Method of Stabilization with Al2O3-Induced Negative Fixed Charge at the Silicon-Liner Interface |
L Zhang (IME/NTU), R I Made (NTU), H Y Li, S Gao, G Q Lo, D L Kwong, C S Tan (NTU) |
2011 IEEE International Electron Devices Meeting, Hilton Washington.1919 Connecticut Ave., NW Washington, DC 5 - 7 December 2011. Published in 7.2.1 pages 147 - 150. |
| Fabrication of High Aspect Ratio TSV and Assembly with Fine-Pitch Low Cost Solder Microbumps for Si Interposer Technology with High-Density Interconnects |
Aibin Yu, John H Lau, Soon We Ho, Aditya Kumar, Wai Yin Hnin, Wen Sheng Lee, Ming Ching Jong,Vasarla Nagendra Sekhar, Vaidyanathan Kripesh, Damaruganath Pinjala, Scott Chen (Siliconware Precision Industries Co, Ltd), Chien-Geng Chan (Siliconware Precision Industries Co, Ltd), Chun-Chieh Chao (Siliconware Precision Industries Co, Ltd),, Chi-Hsin Chiu (Siliconware Precision Industries Co, Ltd), Chih-Ming Huang (Siliconware Precision Industries Co, Ltd) and Carl Chen (Siliconware Precision Industries Co, Ltd) |
IEEE Transactions on Components, Packaging and Manufacturing Technology. Published in Vol. 1, No. 9, September 2011, pages 1336 - 1344. |
| Modelling Stress in Silicon with TSVs and its Effect on Mobility |
C S Selvanayagam, XiaoWu Zhang, R Rajoo, D Pinjala |
IEEE Transactions on Components, Packaging and Manufacturing Technology. Published in Vol. 1, No. 9, September 2011. |
| High Density 3D Interconnect of Cu-Cu Contacts with Enhanced Contact Resistance by Self-Assembled Monolayer (SAM) Passivation |
L Peng (IME/NTU), H Y Li, D F Lim (NTU), S Gao, C S Tan (NTU) |
IEEE Transactions on Electron Devices. Published in Vol. 58, No. 8, August 2011. |
| Stress Analysis in Surrounding Silicon of Cu-Filled Through-Silicon Via Undergoing Thermal Annealing by Multi-Wavelength Micro-Raman Spectroscopy |
W S Kwon, A D Trigg, K H Teo, S Gao, T Ueda (WaferMasters Inc), T Ishigaki (WaferMasters Inc), K T Kang (WaferMasters Inc), W S Yoo (WaferMasters Inc) |
Applied Physics Letters. Published in 98, 232106 (2011), online 8 June 2011. |
| Residual Stress Analysis in Thin Device Wafer Using Piezoresistive Stress Sensor |
Aditya Kumar (IME), Xiaowu Zhang (IME), Q X Zhang (IME), M C Jong (IME), G Huang (NTU), L W S Vincent (IME), V Kripesh (IME), C Lee (IME), John H Lau (IME), D L Kwong (IME), V Sundaram (Georgia Institute of Technology), Rao R Tummula (Georgia Institute of Technology), G Meyer-Berg (Infineon Technologies) |
IEEE Transactions on Components, Packaging and Manufacturing Technology. Published in Vvol. 1, No. 6, June 2011. |
| A Broadband 3D Package for RF MEMS Devices Utilizing Through Silicon Vias (TSVs) |
Y Y Lim, B T Chen, A B Yu, J L Shi |
Transducers 2011, 5 - 9 June 2011, Beijing China. Published in pages no. 406 - 409. |
| Advanced Wafer Thinning and Handling for Through Silicon Via Technology |
Jaesik Lee, Vincent Lee, Justin Seetoh, Serene Mei Ling Thew, Yen Chen Yeo, Hong Yu Li, Keng Hwa Teo, Shan Gao |
The 61st Electronic Components and Technology Confeence (ECTC 2011), 31 May - 3 June 2011, USA. Published pages no. 1852 - 1857. |
| Design, Simulation and Process Optimization of AuInSn Low Temperature TLP Bonding for 3D IC Stacking |
Ling Xie, Won Kyoung Choi, C S Premachandran, Cheryl, Ke Wu Bai (IHPC), Ying Zhi Zeng, Ong Siong Chiew, Liao Ebin, Ahmad Khairyanto, V N Sekhar, Serene Thew |
The 61st Electronic Components and Technology Confeence (ECTC 2011), 31 May - 3 June 2011, USA. Published in pages 279 - 284. |
| A Novel Compact Antenna with a Low Profile Demonstrated on Embedded Wafer Level Packaging (EMWLP) Technology |
Lim Ying Ying, Ho Soon Wee David, Chong Ser Choong, Myo Ei Pa Pa, Lim Teck Guan |
The 61st Electronic Components and Technology Confeence (ECTC 2011), 31 May - 3 June 2011, USA. Published pages no. 1354 - 1362. |
| Novel Thinning/Backside Passivation for Substrate Coupling Depression of 3D IC Applications |
Woonseong KWON, Jaesik, Vincent LEE, Justin SEETOH, Yen Chen YEO, Yee Mong KHOO, Nagarajan Ranganathan, Keng Hwa TEO and Shan GAO |
The 61st Electronic Components and Technology Confeence (ECTC 2011), 31 May - 3 June 2011, USA. Published pages no. 1395 - 1399. |
| Novel Chip Stacking Process for 3D Packaging |
Jaesik Lee, Daniel M Fernandez, Myo Paing, Yen Chen Yeo, Shan Gao |
The 61st Electronic Components and Technology Confeence (ECTC 2011), 31 May - 3 June 2011, USA. Published pages no. 1939 - 1943. |
| Thermal Reliability of Fine Pitch Cu-Cu Bonding with Self Assembled Monolayer (SAM) Passivation for Wafer-on-Wafer 3D-Stacking |
Lan Peng (IME/NTU), Hong Yu Li, Dau Fatt Lim (NTU), Shan Gao, Chuan Seng Tan (NTU) |
The 61st Electronic Components and Technology Confeence (ECTC 2011), 31 May - 3 June 2011, USA. Published in pages 22 - 26. |
| Wafer Level Warpage Modeling Methodology and Characterization of TSV Wafers |
F X Che, H Y Li, Xiaowu Zhang, S Gao, K H Teo |
The 61st Electronic Components and Technology Confeence (ECTC 2011), 31 May - 3 June 2011, USA. Published pages no. 1196 - 1203. |
| Design and Relaibility Analysis of Pyramidal Shape 3-Layer Stacked TSV Die Package |
F X Che, T C Chai, Sharon P S Lim, Ranjan Rajoo, Xiaowu Zhang |
The 61st Electronic Components and Technology Confeence (ECTC 2011), 31 May - 3 June 2011, USA. Published pages no. 1428 - 1435. |
| Process and Reliability Assessment of 200 um-Thin Embedded Wafer Level Packages (eWLPs) |
Hyoung Joon Kim, Ser Choong Chong, Ho Soon Wee David, Eric Yong Woon Yik, Chee Houe Khong, Teo Wei Liang Calvin, Daniel Moses Fernandez, Guan Kian Lau, Nagendra Sekhar, Lee Wen Sheng Vincent, Srinivasa Rao Vempati, Khan O K Navas |
The 61st Electronic Components and Technology Confeence (ECTC 2011), 31 May - 3 June 2011, USA. Published pages no. 78 - 83. |
| Application of Piezoresistive Stress Sensor in Wafer Bumping and Drop Impact Test of Embedded Ultra Thin Device |
Xiaowu Zhang, Ranjan Rajo, C S Selvanayagam, A Kumar, Vempati Srinivasa Rao, Navas Khan, V Kripesh, John H Lau, D L Kwong, V Sundaram (Geogria Institute of Technology), Rao R Tummula (Geogria Institute of Technology) |
The 61st Electronic Components and Technology Confeence (ECTC 2011), 31 May - 3 June 2011, USA. Published pages no. 1276 - 1282. |
| Development of Large Die Fine-{itch Cu/Low-K FCBGA Package with Through Silicon Via (TSV) Interproser |
TC Chai, Xiaowu Zhang, John H Lau, C S Selvanayagam, D Pinjala, YY Hoe, YY Ong, SR Vempati, Eva Wai, HY Li, EB Liao, N Ranganathan, V Kripesh, Shiguo Liu (Ibiden Singapore Pte Ltd), Jiangyan Sun (Shanghai Sinyang Semiconductor Materials, Co., Ltd, M Ravi (Tango Systems), Charles J Vath, III (ASM Technology Singapore Pte Ltd) and Y Tsutsumi (DISCO Hi-Tec (Singapore) Pte Ltd) |
IEEE Transactions on Components, Packaging and Manufacturing Technology. Published in Vol. 1, No. 5, May 2011. |
| Achieving Stable Through-Silicon Via (TSV) Capacitance with Oxide Fixed Charge |
L Zhang (IME/NTU), H Y Li, S Gao, C S Tan (NTU) |
IEEE Electron Device Letters. Published in vol. 32, No. 5, May 2011. |
| A Low Stress Bond Pad Design for Low Temperature Solder Interconnections on Through Silicon Vias (TSVs) |
Xiaowu Zhang, R Rajoo, C S Selvanayagam, C S Premachandran, W K Choi, S W Ho, S C Ong, Ling Xie, D Pinjala, D L Kwong, Yee Mong Khoo, Shan Gao |
IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 1, No. 4 April 2011. |
| Performance Characterization Methods for Optoelectronic Circuit Boards |
Jayakrishnan Chandrappan (IME), Haridas Kuruveettil (IME), Tan Chee Wei (IME), Calvin Teo Wei Liang (IME), Pamidighantam V Ramana (IME), Kenji Suzuki (Mitsui Chemicals Company, Japan), tsiyoshi shioda (Mitsui Chemicals Company, Japan), John Lau (IME) |
IEEE Transactions on Components, Packaging and Manufacturing Technology. Publsiehd in Vol. 1., No. 3, March 2011. |
| Underfill Selection, Characterization, and Reliability Study for fine-Pitch, Large Die Cu/Low-K Flip Chip Package |
Yue Ying Ong (IME), Soon Wee Ho (IME), Vasarla Nagendra Sekhar (IME), Xuefen Ong (IME/CSM), Jimmy Ong (IME/CSM), Xiao Wu Zhang (IME), Kripesh Vaidyanathan (IME), Seung Uk Yoon (IME), Lim Yeow Kheng (CSM), David Yeo (CSM), Kai Chong Chan (CSM), Yanfeng Zhang (CSM), Juan Boon Tan (CSM) and Dong Kyun Sohn (CSM) |
IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 1, No. 3, March 2011. PP 279 - 290. |
| Development of a Cu/Low-k Stack Die Fine Pitch Ball Grid Array (FB GA) Package for System in Package Applications |
Xiaowu Zhang, John H Lau (Industrial Technology Research Institute), C S Premachandran, Ser-Choong Chong, Leong Chin Wai, Vincent Lee, T C Chai, V Kripesh, V K Sekhar, D Pinjala, F X Che |
IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 1, No. 3, March 2011. |
| Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition |
F X Che, W H Zhu (UTAC), Edith S W Poh (UTAC), X R Zhang (UTAC), Xiaowu Zhang), T C Chai, S Gao |
Journal of Electronic Materials. Published in Vol. 40, No. 3, 2011. Online 3 Feb 2011. |
| Integrated Optical Carrier for Optical/Electrical Interconnect |
Lim Teck Guan, Khoo Yee Mong, Joey Chai Yi Yoon, Calvin Teo Wei Liang, Germaine Hoe Yen Yi, Yap guan Jie, P V Ramana, Tan Chee Wei, Pinjala Damaruganath |
IEEE Transactions on Components, Packaging, And Manufacturing Technology, Vol. 1, No. 1, January 2011. |
| Process Development and Reliability of Microbumps |
Sharon Lim Pei-Siang, Vempati Srinivasa Rao, Hnin Wai Yin, Wai Leong Ching, V Kripesh, Charles Lee, John Lau, Juan Milla (Medtronics) and Andy Fenner (Medtronics) |
IEEE Transactions on Componentgs and Packaging Technologies. Published in Vol. 33, No. 4, December 2010. |
| High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP) |
Ying Ying Lim, Sianghua Xiao (Superior Multi-Packaging Ltd), Srinivasa Rao Vempati, Nandur Su, Aditya Kumar (GLOBALFOUNDARIES), Gaurav Sharma (STATS ChipPAC Ltd), Teck Guan Lim, Kripesh Vaidyanathan, Jing Lin Shi, John Lau (Institute technology Research Institute), Shiguo Liu (Ibiden Singapore Pte Ltd) |
IEEE Transactions on Advanced Packaging. Published in Vol. 33, No. 4, November 2010. PP 1061 - 1071. |
| 3D Interconnection Process Development and Integration with Low Stress TSV |
T T Chua, S W Ho, H Y Li, E B Liao, C H Khong, E B Liao, SP Chew , W S Lee, L S Lim, X F Pang, S L Kriangsak (UTAC), Catherine Ng (UTAC), S Nathapong (UTAC), C H Toh (UTAC), |
Electronic Components and Technology Conference 2010, 1 - 4 June 2010, Las Vegas, USA. Published pages no. 798 - 802. |
| Three Chips Stacking with Low Volume Solder Using Single Re-Flow Process |
Navas Khan, S W Ho, Joe Ong, Cheryl Sharmani, Li Shiah Lim, H Y Li, Shekar Vasarala |
Electronic Components and Technology Conference 2010, 1 - 4 June 2010, Las Vegas, USA. Published pages 884 - 888. |
| Characterization and Management of Wafer Stress for Various Pattern Densities in 3D Integration Technology |
X F Pang, T T Chua, H Y Li, E B Liao, W S Lee F X Che |
Electronic Components and Technology Conference 2010, 1 - 4 June 2010, Las Vegas, USA. Published pages no. 1866 - 1869 |
| Fast Electroplating TSV Process Development for the Via-Last Approach |
Hongyu Li, Ebin Liao, Xue Fang Pang, Han Yu (Shanghai Sinyang Semiconductor Materials Co., Ltd), Ltd), Xin Xin Yu (Shanghai Sinyang Semiconductor Materials Co., Ltd) and Jan Yan Sun (Shanghai Sinyang Semiconductor Materials Co., |
Electronic Components and Technology Conference 2010, 1 - 4 June 2010, Las Vegas, USA. Published pages 777 - 779. |
| Design, Process Integration and Characterization of Wafer Level Vacuum Packaging for MEMS Resonator |
Aibin Yu, C S Premachandran, Ranganathan Nagarajan, Choi Won Kyoung, Lam Quynh Trang, Rakesh Kumar, Li Shiah Lim, Johnny He Han, Yap Guan Jie and Pinjala Damaruganath |
Electronic Components and Technology Conference 2010, 1 - 4 June 2010, Las Vegas, USA. Published pages 1669 - 1673. |
| A Novel Die To Wafer (D2W) Collective Bonding Method for MEMS and Electronics heterogeneous 3D Integration |
Won Kyoung Choi, C S Premachandran, Xie Ling, AiBin Yu, Siong Chiew Ong, Johnny Han He and Guan Jie Yap |
Electronic Components and Technology Conference 2010, 1 - 4 June 2010, Las Vegas, USA. Published pages no. 829 - 833. |
| Design of Wideband Bandpass Filters Using Si-BCB Technology for Millimeter-Wave Applications |
Rui Li, Teck Guan Lim, Soon Wee Ho, Yong Zhong Xiong and Damaruganath Pinjala |
Electronic Components and Technology Conference 2010, 1 - 4 June 2010, Las Vegas, USA. Published pages 515 - 519. |
| A Low Stress Bond Pad Design for Low Temperature Interconnections on Through Silicon Vias (TSVs) |
Xiaowu Zhang, R Rajoo, C S Selvanayagam, C S Premachandran, W K Choi, S W Ho, S W Ong, Ling Xie, D Pinjala, V N Sekhnar D L Kwong |
Electronic Components and Technology Conference 2010, 1 - 4 June 2010, Las Vegas, USA. Published papers 1657 - 1663. |
| Design and Development of Fine Pitch Copper/Low-K Wafer Level Package |
Vempati Srinivasa Rao, Xiaowu Zhang, Ho Soon Wee, C S Premachandran, V Kripesh, Seung Wook Yoon (STATS ChipPAC Ltd), John Lau (ITRI) |
IEEE Transactions on Advanced Packaging. Published in vol. 33, No. 2, May 2010. |
| Development of Optical Subassembly for Plastic Optical Fier In High Speed Application |
Zhang Jing, P V Ramana, Jayakrishnan Chandrappan, Tan Chee Wei, Chai Yi Yoon, Teo Wei Liang, John Lau, Philbert Oliver Gomex (NTU), Wang Ting (NTU) and V M Ramkumr (NUS) |
IEEE Trans on Advanced Packaging. Published in Vol. 33, No. 2, May 2010. |
| Development of 3D Silicon Module with TSV for System in Packaging |
Navas Khan, Vempati Srinivasa Rao, Smule Lim, Ho Soon We, Vincent Lee, Xiaowu Zhang, Yang Rui, Liao Ebin, Ranganathan N, T C Chai, V Kripesh and John Lau (IME) |
IEEE Transactions on Components and Packaging Technologies. Published in Vol. 33, No. 1, March 2010. |
| Wafer level Hermtic Bonding Using Sn/In ad Cu/Ti/Au Metallization |
Daquan Yu, Li Yang Yan, Chengkuo (IME/NUS), Won Kyoung Choi, Meei Ling Thew, Chin Keng Foo and John H Lau |
IEEE Transactions on Components and Packaging Technologies. Published in Vol. 32, No. 4, December 2009. |
| Application of Piezoresistive Stress Sensors in Ultra Thin Device Handling and Characterization |
Xiaowu Zhang, A Kumar, Q X Zhang, Y Y Ong, S W Ho, C H Khong, V Kripesh, John H Lau, D L Kwong), V Sundaram (Georgia Institute of Technology), Rao R Tummula (Georgia Institute of Technology), Georg Meyer-Berg (Infineon Technologies AG) |
Sensors and Actuators A. Published in 156 (2009). |
| Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV Through Silicon Via) and Their Flip-Chip Microbumps |
Cheryl S Selvanayagam, John H Lau, Xiaowu Zhang, S K W Seah, Kripesh Vaidyanathan and T C Chai (IME) |
IEEE Transactions on Advanced Packaging. Published in vol. 32, No. 4, November 2009. |
| Study of Low Temperature Thermocompression Bonding by Ag-In Solder for Packaging Applications |
Riko I Made (NTU/Singapore-MIT Aliance/IME), Chee Lip Gan (NTU/Singapore-MIT Aliance), Li Ling Yan (IME), Aibin Yu (IME), Seung Wook Yoon (IME), John H Lau (IME) and Chengkuo Lee (IME/NUS) |
Journal of Electronics Materials. Published in Vol. 38, No. 2, 2009. |
| A 1-V Operated MEMS Variable Optical Attenuator Using Piezoelectric PZT Thin-Film Actuators |
Chengkuo Lee, Fu-Li Hsiao, Takeshi Kobayashi, Kah How Koh, P. V. Ramana, Wenfeng Xiang,
Bin Yang, Chee Wei Tan, and D. Pinjala |
Journal of Electronics Materials. Published in Vol. 38, No. 2, 2009. |
| Fabrication of Silicon Carriers with TSV Electrical Interconnections and Embedded Thermal Solutions for High Power 3-D Packages |
Aibin Yu, Navas Khan, Giridhar Archit (NTU), Kok Chuan Toh (NTU), V Kripesh, Seung Wook Yoon and John H Lau |
IEEE Transactions on Components and Packaging Technologies. Published in vol. 32, No. 3, September 2009. |
| Optical Coupling Methods for Cost Effective Polymer Optical Fiber Communication |
Jayakrishnan Chandrappan, Zhang Jing, Ramkumar Veppathur Mohan (NUS), Philbert Oliver Gomez (NTU), Than Aye Aung (Ngee Ann Polytechnic), Xiao Yongfei (NUS), P V Ramana, John Lau Hon Shing and Dim Lee Kwong |
IEEE Transaction on Component and Packaging Technologies. Published in Vol. 32, No. 3 September 2009. |
| Characterization of Intermediate In/Ag Layers of Low Temperature Fluxless Solder Based Wafer Bonding for MEMS Packaging |
Chengkuo Lee (NUS/IME), Aibin Yu, Liling Yan, Haitao Wang (NUS), Johnny He Han, Qing Xin Zhang and John H Lau |
Sensors and Actuators A. Published in 154 (2009) 85 - 91. |
| Development of Optical MUX/DEMUX on Silicon Optical Bench - Assembly Acuracies |
Tan Chee Wei, Lim Teck Guan, Li Jing, Tangdiongga Geri Endrio, Chai Yi Yoon, Seiji Maruo (Hitachi Cable Ltd), P V Ramana, Yoon Seung Wook and John H Lau |
IEEE Trans. On Adv Packaging. Published in Vol. 32, No. 3, August 2009. |
| Demonstration of Direct Coupled Optical/Electrical Circuit Board |
Teck Guan Lim, P V Ramana, Bryan Sik Pong Lee, Tsuyoshi Shioda (Mitsui Chemical), Haridas Kuruveettil (Mitsui Chemicals), Jing Li (IME), Kenji Suzuki (Mitsui Chemcials), Kazuhito Fujita (Mitsui Chemicals), Kazuhiro Yamada (Mitsui Chemical), D Pinjala and John Lau |
IEEE Transactions on Advaced Packaging. Published in Vol. 32, No. 2, May 2009, pp 509 - 516 |
| Fabrication and Testing of a Wafer-Level Vacuum Package for MEMs Device |
C S Premachandran, Ser Choong Chong, Saxon Liw Ranganthan Nagarajan (IME) |
IEEE Transactions on Advanced Packaging. Published in Vol. 32, No. 2, May 2009. |
| Development of a Disposable Bio-Microfluidic Package with Reagents Self-Contained Reservoirs and Micro-valves for a DNA Lab and a Chip (LOC) Application |
Ling Xie, C S Premachandran, Michelle Chew and Ser Choong Chong |
IEEE Trans Advanced Packaging. Published in Vol. 32, No. 2, May 2009. |
| Design, Fabrication and Assembly of An Optical Biosensor Probe Package for OCT (Optical Coherence Tomography) Application |
C S Premachandran, Ahmad Khairyanto, Kelvin Chen Wei Sheng, Janak Singh, Jason Teo, Xu Yingshun (NUS), Chen Nanguang (NUS), Colin Sheppard (NUS) and Malini Olivo (National Cancer Centre, Singapore) |
IEEE Transactions on Advanced Packaging. Published in Vol. 32, No. 2, May 2009. |
| Development of 3-D Silicon Die Stacked Package Using Flip Chip Technology with Micro Bump Interconnects |
Vempati Srinivasa Rao, Nandar Su, Khong Chee Houe, Lim Ying Ying, Kripesh Vaidyanathan, John H Lau, B P Liew (UTAC), K Y Au (UTAC), Susanto Tanary (UTAC), Fenner Andy (Medtronics), Erich Robert (Medtronics), Milla Jaun (Medtronics) |
The 59th Electric Components and Technology Conference (ECTC 2009), 26 - 29 May 2009, San Diego, California, USA.. Published pages 980 - 987. |
| Development of Through Silicon Via (TSV) Interproser Technology for Large Die (21x21m) Fine-Pitch Cu/Low-k FCBGA Package |
Xiaowu Zhang, T C Chai, John H Lau, Cheryl S Selvanayagam, Kalyan Biswas (Ibiden S'pore Pte Ltd), Shiguo Liu (Ibiden S'pore Pte Ltd),D Pinjala, G Y Tang, Y Y Ong, S R Vempati, Eva Wai, H Y Li, E B Liao, N Ranganathan, V Kripesh, Jiangyan Sun (Shanghai Sinyang Semicodnuctor Materials Co, Ltd), John Doricko (Tango Systems, Inc.), C J Vath III ASM Technology Signapore Pte Ltd) |
The 59th Electric Components and Technology Conference (ECTC 2009), 26 - 29 May 2009, San Diego, California, USA. Published pages no. 305 - 312. |
| 3D Packaging with Through Silicon Via (TSV) for Electrical and Fluidic Interconnections |
Navas Khan, Li Hong Yu, Hoo Soon Wee, Nandar, Wai Yin, Kripesh Vaidyanathan, D Pinjala, John Lau, Tan Siow Pin (NTU), toh Kock Chuan (NTU) |
The 59th Electric Components and Technology Conference (ECTC 2009), 26 - 29 May 2009, San Diego, California, USA. Published pages no. 1153 - 1158. |
| Demonstrtion of High Quality and Low Loss Millimeter Wave Passives on Embedded Wafer Level Packaging Platform |
Lim Ying Ying, Xiao Xianghua (Ibiden S'pore Pte Ltd), Vempati Srinivasa Rao, Nandar Su, Liu Shiguo (Ibiden S'pore Pte Ltd), Phyo Phyo Thaw, Aditya Kumar, Gaurav Sharma, Lim Teck Guan, V Kripesh and John H Lau |
The 59th Electric Components and Technology Conference (ECTC 2009), 26 - 29 May 2009, San Diego, California, USA. Pubished pages no. 508 - 515. |
| A Novel Method to Predict Die Shift During Compression Molding in Embedded Wafer Level Package |
Chee Houe Khong, Aditya Kumar, Xiaowu Zhang, Sharma Gaurav, Srinivas Vempati, V Kripesh, John H Lau, Dim-Lee Kwong |
The 59th Electric Components and Technology Conference (ECTC 2009), 26 - 29 May 2009, San Diego, California, USA. Pubished pages no. 535 - 541. |
| Three Dimensional Interconnects with High Aspect Ratio TSVs and Fine Pitch Solder Microbumps |
Aibin Yu, John H Lau, Soon Wee Ho, Aditya Kumar, Hnin Wai Yin, Jong Ming Ching, Vaidyanathan Kripesh, D Pinjala, Chi-Hsin Chiu (Siliconware Precision Industries Co, Ltd), James Chiang (Siliconware Precision Industries Co, Ltd) and Carl Chen (Siliconware Precision Industries Co, Ltd) |
The 59th Electric Components and Technology Conference (ECTC 2009), 26 - 29 May 2009, San Diego, California, USA. Published pages no. 350 - 354. |
| Study of 15µm Pitch Solder Microbumps for 3D IC Integration |
Aibin Yu, John H Lau, Soon Wee Ho, Aditya Kumar, Hnin Wai Yin, Da-Quan Yu, Khong Chee Houe, Zhang Xiao Wu, Jong Ming Ching, Vaidyanathan Kripesh, D Pinjala and Dim-Lee Kwong |
The 59th Electric Components and Technology Conference (ECTC 2009), 26 - 29 May 2009, San Diego, California, USA. Published pages no. 6 - 10. |
| Electromigration Study of 50µm Pitch Micro Solder Bumps Using Four-Point Kelvin Structure |
D Q Yu, T C Hai, M L Thew, Y Y Ong, L C Wai, John H Lau |
The 59th Electric Components and Technology Conference (ECTC 2009), 26 - 29 May 2009, San Diego, California, USA. Published pages no. 930 - 935 |
| Embedded Micro Wafer Level Packages with Laterally Placed and Vertically Stacked Thin Dies |
Gaurav Sharma, Vempati Srinivas Rao, Aditya Kumar, Nandar Su, Lim Ying Ying, Khong Chee Houe, Sharon Lim, Vaidyanathan Kripesh and John H Lau |
The 59th Electric Components and Technology Conference (ECTC 2009), 26 - 29 May 2009, San Diego, California, USA. Published pages no. 1537 - 1543. |
| Development of Novel Intermetallic Joints Using Thin Film Indium Based Solder by Low Temperature Bonding Technology for 3D IC Stacking |
Won Kyoung Choi, C S Premachandran, Ong Siong Chiew, Xie Ling, Liao Ebin, Ahmad Khairyanto Bin Ratmin, Kelvin Chen Wei Sheng, Phyo Phyo Thaw and John H Lau |
The 59th Electric Components and Technology Conference (ECTC 2009), 26 - 29 May 2009, San Diego, California, USA. Published pages no. 333 - 338. |
| Wafer Level Embedding Technology for 3D Embedded Wafer Level Package |
Aditya Kumar, D Xia (Kinergy Ltd), V N Sekhar, S L P Siang, C K Foo, G Sharma, V S Rao, V Kripesh, John H Lau and D L Kwong |
The 59th Electric Components and Technology Conference (ECTC 2009), 26 - 29 May 2009, San Diego, California, USA. Published pages no. 1289 - 1296. |
| The Role of Ni Buffer Layer on High Yield Low Temperature Hermetic Wafer Bonding Using In/Sn/Cu Metallization |
Da-Quan Yu, Chengkuo Lee (IME/NUS), Li Ling Yan, Won Kyoung Choi, Aibin Yu and John H Lau |
Applied Physics Letters. Published in 94, 034105 (2009). |
| Effect of Electromigration on the Mechanical Performance of Sn-3.5 Ag Solder Joints with Ni and Ni-P metallizations |
Aditya Kumar (NTU/IME), Ying Yang (NTU), Chee C Wong (NTU), V Kripesh, Zhong Chen (NTU) |
Journal of Electronic Materials. Published in Vol. 28, No. 1, 2009. |
| Integrated Process-aging Modeling Methodology for Flip Chip on Flex Interconnections with Non-Conductive Adhesives |
Xiaowu Zhang, E H Wong, R Rajoo, M K Iyer, J F J M Caers (Philips Applied Technologies) and X J Zhao (Philips Applied Technologies) |
IEEE Trans. On Advanced Packaging. Published in Vol. 31, No. 4, November 2008. |
| Impact of Packaging Process on Cap Wrpage of Silicon Based Capacitive Microrelay |
Xiaowu Zhang, C S Premachandran, T C Chai and John H Lau |
Eurosensors 2008, 7 - 10 Sep 2008, Germany. Published pages no. 487 to 490. |
| Application of Piezoresistive Stress Sensors in Ultra Thin Device Handling and Characterization |
Xiaowu Zhang, A Kumar, Q X Zhang, Y Y Ong, S W Ho, C H Khong, V Kripesh, John H Lau, D L Kwong, V Sundaram (Georgia Institute of Technology), Rao R Tummula (Georgia Institute of Technology), Georg Meyer-Berg (Infineon Technologies AG) |
Eurosensors 2008, 7 - 10 Sep 2008, Germany. Published pages 132 to 135. |
| Study on High Yield Wafer to Wafer Bonding using In/Sn and Cu Metallization |
Da Quan Yu, Li Ling Yan, Chengkuo Lee (IME/NUS), Won Kyoung Choi, Seung Uk Yoon and John H Lau |
Eurosensors 2008, 7 - 10 Sep 2008, Germany. Published pages 1242 to 1245. |
| A Hermetic Seal Using Composite Thin Film In/Sn Solder as an Intermediate Layer and Its Interdiffusion Reaction with Cu |
Liling Yan, Chengkuo Lee (IME/NUS), Daquan Yu, Aibin Yu, Won Kyoung Choi, John H Lau and Seung Uk Yoon |
Journal of Electronic Materials. Published in Vol. 38, No. 1, 2009. |
| Packaging and Assembly of 3D Silicon Stacked Module for Image Sensor Application |
Seung Wook Yoon, Ganesh V P, Samuel Yak Long Lim and Vaidyanathan Kripesh |
IEEE Transactions on Advanced Packaging. Published in Vol. 31, No. 3, August 2008. |
| Implementation of Packaged Integrated Antenna with Embedded Front End for Bluetooth Applications |
Rotaru Mihai (IME/University of Southampton, UK), Lim Ying Ying, Haridas Kuruveettil , Yang Rui, Popov P Alexander (NUS) and Chua Chee Parng (Perlos Asia) |
IEEE Transaction on Advanced Packaging. Published in IEEE Adv Packaging, Vol 31,No 3,2008. |
| Design and Characterization of Taper Coupler for Effective Laser and Single Mode Fiber Coupling with Large Tolerance |
Zhang Jing, P V Ramana, Joh Lau Hon-Shing, Zhang Zingxin, Jayakrishnan Chandrappan, Tan Chee Wei, Jong Ming Chinq, Calvin Teo Wei Liang and Kong Dim Lee |
IEEE Photonics Technologies Letters. Published in Vol. 20, No. 16, August 15, 2008. |
| Effect of Wafer Back Grinding on the Mechanical Behaviour of Multilayered Black Diamond (low-k) Stack |
V N Sekhar, Lu Shen (IMRE), Aditya Kumar, T C Chai, Lee Wen Sheng Vincent, Zhang X W, C S Premchandran |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 1517 - 1524. |
| Impact of Packaging Design on Reliability of Large Die Cu/Low K (BD) Interconnect |
Chai T C, X W Zhang, H Y Li, V N Sekhar, Hnin W Y, Thew ML, OK Navas, R Murthy, S Balakumar, Tan Y M (IMRE), Cheng C K (SIMTech), S L Liew (IMRE) and Chi C Z (IMRE) |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 38 - 45. |
| Angled High Strain Rate Shear Testing of SnAgCu Solder Ball |
Chai T C, Yu D Q, John Lau, Zhu W H, X R Zhang (UTAC) |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no.623 - 628. |
| Nonlinear Thermal Stress and Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps |
Selvanayagam C S, Lau JH, Zhang XW, V Kripesh and T C Chai |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 1073 - 198. |
| Fabrication of Silicon Carriers with TSV Electrical Interconnections and Embedded Thermal Solutions for High Power 3-D Packages |
Aibin Yu, Navas Khan, Giridhar Archit (NTU), Kok Chuan Toh (NTU), V Kripesh, Seung Wook Yoon and John H Lau |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages 24 - 28. |
| Bi-Directional Optical Communication at 10 Gb/s on FR4 PCB Using Reflow solderable SMT Transceiver |
P V Ramana, Haridas Kuruveettil, Byan Lee Sik Pong, Tan Chee Wei, Jayakrishnan Chandrappan, Lim Teck Guan, Calvin Teo Wei Liang, Chai Yi Yoon, Kenji Suzuki (Mitsui), Tsiyoshi Shioda (Mitsui), Yap Guan Jie, Cheryl Dharmani, John Lau Hon-Shing |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 244 - 249. |
| Development of Low Temperature Bonding Using In-based Solders |
Won Kyoung Choi, Daquan Yu, Chenguo Lee (IME/NUS), Liling Yan), Aibin Yu, Seung Uk Yoon), John H Lau, Moon Gi Cho (Korea Advanced Institute of Science and Technology), Yoon Hwan Jo (Korea Advanced Institute of Science and Technology), and Hyuck Mo Lee (Korea Advanced Institute of Science and Technology) |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages 1294 - 1299. |
| A Hermetic Chip to Chip Bonding at Low Temperature with Cu/In/Sn/Cu Joint |
Liling Yan, Chenguo Lee (IME/NUS), Daquan Yu, Won Kyoung Choi, Aibin Yu , Seung Uk Yoonand John H Lau |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages 1844 - 1848. |
| Design and Development of a Multidie Embedded Wafer Level Package |
V Kripesh, Vempati Srivasa Rao, Zhang Xiaowu, Navas Khan, Lim Samuel, Ho Soon Wee, Khong Chee Houe, Khoo Yee Mong and John Lau |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 1544 - 1549. |
| High RF Performance TSV Silicon Carrier for High Frequency Application |
David Soon Wee Ho, Seung Wook Yoon, Q E Zhou (NTU), K Prasad (NTU), V Kripesh and John Lau |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 1946 - 1952. |
| Development of 3D silicon module with TSV for system in packaging |
Navas Khan, Vempati Srinivas Rao, Samule Lim, Ho Soon We, Vincent Lee, Zhang Xiao Wu, Yang Rui, Liao Ebin, Ranganathan N, Chai Tai Chong and V Kripesh |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 550 - 555. |
| A Novel Wafer Level Stacking Method for Low Yield and Non Uniform Chip Size Wafers for MEMS and 3D Packaging Applications |
C S Premachandra, Xie Ling and John Lau |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages 314 - 318. |
| Influence of Optical Porbe Packaging on a 3D MEMS Scanning Micro-Mirror for Optical Coherence Tomography (OCT) Applications |
C S Premachandran, Ahmad Khairyanto, Kelvin Chen, Janak Singh (IME); Xu Yingshun, Chen Nanguang, Collin Sheppard (NUS) |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 829 - 833. |
| Optimization of a Microfluidic Packages for Lab On a Chip (LOC) Applications and Bio-Testing of DNA/RNA Extraction |
Ling Xie, C S Premachandran, Michelle Chew, Ser Choong Chong, Leong Ching Wai |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages no. 1310 - 1316. |
| Optimization of Reliability of Copper-Low K Flip Chip Package with Variable Interconnect Compliance |
J M G Ong (NUS/CSM/IME), A A O Tay (NUS), Y K Lim, J B Tan (CSM), D K Sohn (CSM), X Zhang, V Kripesh |
ECTC 2008. 27 - 30 May 2008, Florida USA. Published pages 1031 - 1035. |
| Development of Stretch Solder Interconnections for Wafer Level Packaging |
R Rajoo, E H Wong, S S Lim, W Y Hnin, Seah S K W , A A O Tay (NUS) and Mahadevan K Iyer (Georgia Institute of Technology) and Rao R Tummala (Georgia Institute of Technology) |
IEEE Transactions on Advanced Packaging. Published in vol. 31, No. 2, May 2008. |
| Stress-Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modelling |
E H Wong, C S Selvanayagam, S K W Seah, W D van Driel (NXP Semiconductors), J F J M Caers (Philips Applied Technologies), X J Zhao (Philips Applied Technologies), N Owens (Freescale Semiconductors), Y S Lai (Central Labs, ASE) and C L Yeh (CenralLabs, ASE) |
Journal of Electronic Materials. Published in vol. 37, No. 6, 2008. |
| A More Comprehensive Solution for Tri-Material Layers Subjected to Thermal Stress |
E H Wong and Thiam Beng Lim |
IEEE Transactions on Components and Packaging Technologies. Published in vol. 31, No. 1, March 2008, pages 54 - 64. |
| 150um Pitch Cu/Low-k Flipchip Packaging with PEDL (Polymer Encapsulated Dicing Line) and Cu Column Interconnects |
Seung Wook Yoon, Serene Meei Ling Thew), Samuel Yak Long Lim, Wai Ynn Hnin, Tai Chong Chai, Akella G K Viswanath (IHPC) and Vaidyanathan Kripesh |
IEEE Transactions on Advanced Packaging. Published in Vol. 31, No. 1, February 2008. |
| Reliability of a Silicon Stacked Module for 3D SiP Microsystem |
Seung Wook Yoon, Samuel Yak Long Lim, Akella G K Viswanath (IHPC), Serene Thew Tai Chong Chai and Vaidyanathan Kripesh |
IEEE Transactions on Advanced Packaging. Published in Vol. 41, No. 1, February 2008. |
| Development of 3D Stack Package Using Silicon Interposer for High Power Application |
Navas Khan, S W Yoon, Akella G K Viswanath (IHPC), V P Ganesh, Ranganathan N, David Witarsa (Atotech SEA Ltd), Samuel Lim and V Kripesh |
IEEE Transactions Advanced Packaging. Published in Vol. 31, No. 1, February 2008. |
| Study of Ag-In Solder as Low Temperature Wafer Bonding Intermediate Layer |
I Made Riko (IME/NTU), Chee Lip Gan (NTU), Chengkuo Lee (IME/NUS), Li Ying Yan, Aibin Yu, Seung Uk Yoonand John H Lau |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Development of Wafer Level Packaged Scanning Micromirrors |
Aibin Yu, Chengkuo Lee (IME/NUS), Li Ling Yan, Qing Xin Zhang, Seung Uk Yoon, John H Lau and Chengkuo Lee (IME/NUS) |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| 3.125Gbps Multi Channel Electrical Transmission Line Design for CWDM |
Lim Teck Guan, Khoo Yee Mong, Li Jing, Chai Yi Yoon, Tan Chee Wei, P V Ramana, John Lau Hon Shing; Seiji Maruo (Hitachi Cable Ltd, Japan) |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Development of a Low Cost 2.5 Gbps SFF Optical Transceiver using 0.18 um CMOS ICs |
Chai Yi Yoon, Zhang Jing, P V Ramana, Yap Guan Jie, John Lau Hon-Shing |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Taper Couplers for Effective Coupling Between Laser and Silicon Waveguide with Large Allowable Tolerance |
Zhang Jing, Li Bihan (IME/NUS), Jayakrishnan Chandrappan, Zhang Qing Xin, P V Ramana, Patinharekandy Prabhattan (NTU), John Lau, Kwong Dim Lee and Murukeshan Vadakke matham (NTU) |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Optical Design of a Miniature Semi-Integrated Tunable Laser on a Silicon Optical Bench |
P V Ramana, Li Jing, Jayakrishnan Chandrappan, Lim Teck Guan, Zhang Jing, John Lau Hon Shing and Dim Lee Kwong |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Design and Analysis of 3D Stacked Optoelectronics on Optical Printed Circuit Boards |
John Lau, Lim Ying Ying, Lim Teck Guan, Tang Gong Yue, Khong Chee Houe, Xiaowu Zhang, P V Ramana, Zhang Jing, Tan Chee Wei, Jayakrishnan Chandrappan, Joey Chai Yi Yoon, Li Jing, Tangdiongga Geri Endrio and Kwong Dim Lee |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Optical Design of 4-channel TOSA/ROSA for CWDM Applications |
G Tangdiongga, Lim Teck Guan, Jing Li , Tan Chee Wei, P V Ramana , Chai Yi Yoon, Seiji Mauro (Hitachi Cable Ltd) and John Lau Hon-Shing |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| A Biocompatible Miniaturized Package Housing for a 3D Micromirror Based Optical Bioprobe for OCT Imaging Application |
C S Premachandran, Ahmad Khairyanto, Kelvin Chen and Janak Singh |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| A Novel Approach on Fluid Dispensing for a DNA/RNA Extraction Chip Package |
Ling Xie, C S Premachandran , Michelle Chew, Qiang Yao (IHPC), Diao Xu (IHPC) and D Pinjala |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Assembly of Optical MUX/DEMUX on Silicon Optical Bench with High Placement Accuracies |
Tan Chee Wei, Lim Teck Guan, Li Jing, Tangdiongga Geri Endrio, Chai Yi Yoon, Seiji Maruo (Hitachi Cable Ltd), P V Ramana and John H Lau |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Cost Effective Optical Coupling for Enhanced Data Rate POF Communications |
Jayakrishnan Chandrappan, Zhang Jing, Xiao Yongfei, P V Ramana, John Lau Hon Shing and Dim Kwong |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Design and Modeling of Nanophotonic Beam Structures as Optical NEMS Sensors |
Chengkuo Lee (IME/NUS), Jayaraj Thillaigovindan (NUS), Aibin Yu (IME), Rohit Radhakrishnan (NUS), Chii-Chang Chen (NUS), Ta-Ting Chao (Yuan Ze University, Taiwan) and John H Lau |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Cost Effective Optical Coupling for Polymer Optical Fiber Communication |
Jayakrishnan Chandrappan, Zhang Jing, Ramkumar V Mohan (NUS), Philbert Oliver Gomez (NTU), Than Aye Aung (ngee Ann Polytechnic), Xiao Yongfei (NUS), P V Ramana, John Lau and Dim Lee Kwong |
SPIE Photonics West, 19 - 24 Jan 08, USA. |
| Design of A Bidirectional WDM Module for WDM Multi-channel Transceivers |
Zhang Jing, Lim Teck Guan, Li Jing, P V Ramana, V M Ramkumar (NUS), D Pinjala, John Lau and Kwong Dim Lee |
SPIE APOC 2007, 1 - 5 Nov 2007, China Wuhan |
| Design of Taper Coupler for Effective Laser and ingle Mode Fiber Coupling with Large Tolerance |
Zhang Jin, P V Ramana, John Lau, Zhang Qingxin, Jayakrishnan Chandrappan, Tan Chee Wei, Jong Ming Chinq, Calvin eo Wei Liang and Dim Lee Kwong |
SPIE APOC 2007, 1 - 5 Nov 2007, China Wuhan |
| Analytical Solution for Interconnection Stress in Board Level Drop Impact |
E H Wong (IME/University of Sydney), Y W Mai (University of Sydney), S K W Seah, K M Lim (NUS, Dept of Mechanical & Production Engineering) and T B Lim |
IEEE Transactions on Advanced Packaging. Published in Vol. 30, No. 4, Nov 2007. |
| Synthesis and Characterization of Patterned and Non-Patterned Copper and Nickel Nanowire Arays on Silicon Substrate |
Gaurav Sharma, Vaidyanathan Kripesh, Mong Chea Sim (NUS) and Chorng Haur Sow (NUS) |
Sensors and Actuators A - Physical. Published in A 139 (2007) 272 - 280. |
| Demonstration of High Frequency Data Link on FR4 PCB Using Optical Waveguides |
Teck Guan Lim, Bryan Sik Pong Lee, Tsuyoshi Shioda (Mitsui), Haridas Kuruveettil (Mitsui), Jing Li (Mitsui), Kenji Suzuki (Mitsui), Kazuhito Fujita (Mitsui), Kazuhiro Yamada (Mitsui) and P V Ramana |
Electronic Components & Technology Conference, May 29 - June 1, 2007 |
| Design, Integration and Testing of Fluidic Dispensing Control Valve into a DNA/RNA Sample Preparation Microfluidic Package for Point of Care Applications |
Ling Xie, C S Premachandran, Ser Choong Chong and Michelle Chew |
Electronic Components & Technology Conference, May 29 - June 1, 2007 |
| Large Scale Micro-Components Assembly Using an External Magnetic Array |
Qasem Ramadan, Yoon Seung Uk and Kripesh Vaidyanathan |
Applied Physics Letters. Published in 90, 172502 (2007). |
