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Patents
Patents | ICS Patents | SPT Patents
MMC Patents |
| US Pat 7,230,318
| RF and MMIC stackable micro-modules
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| US Pat 7,189,594
| Wafer level packages and methods of fabrication
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| US Pat 7,183,176
| Method of Forming Through Wafer Interconnects for Vertical Wafer Level Packaging
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| US Pat 7,178,711
| Method and device to elongate a solder joint
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| US Pat 7,160,756
| Polymer encapsulated dicing lane (PEDL) technology for Cu/low/Ultra-Low k devices
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| US Pat 7,160,025
| Micromixer apparatus and methods of using same
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| US Pat 7,141,487
| Method for ultra thinning bumped wafers for flip chip
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| US Pat 7,091,057
| Method of making a single-crystal-silicon 3D micromirror
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US Pat 6,890,795
| Wafer level super stretch solder
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US Pat 6,879,287
| Packaged integrated antenna for circular and linear polarizations
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| US Pat 6,873,527
| Heat Transfer Apparatus
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US Pat 6,858,459
| Method of Fabricating Micro-Mirror Switching Device
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US Pat 6,855,640
| Apparatus and process for bulk wet etch with leakage protection
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US Pat 6,808,644
| Capillary with glass internal surface
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US Pat 6,787,456
| Wafer-level inter-connector formation method
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US Pat 6,765,300
| Micro-relay
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US Pat 6,759,319
| Residue-free solder bumping process
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US Pat 6,762,049
| Miniaturized multi-chamber thermal cycler for independent thermal multiplexing
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US Pat 6,717,812
| Apparatus and method for fluid-based cooling of heat-generating devices
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US Pat 6,716,661
| Process to fabricate an integrated micro-fluidic system on a single wafer
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US Pat 6,710,438
| Enhanced chip scale package for wire bond dies
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US Pat 6,662,654
| Z-axis Accelerometer
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US Pat 6,621,151
| Lead Frame for an Integrated Circuit Chip
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US Pat 6,617,667
| Optical device carrier
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US Pat 6,566,650
| Incorporation of Dielectric Layer onto SThM Tips for Direct Thermal Analysis
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US Pat 6,608,379
| Enhanced Chip Scale Package for Flip Chips
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US Pat 6,599,138
| High Frequency Board-To-Board Connector
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US Pat 6,573,154
| High aspect ratio trench isolation process for surface micromachined sensors and actuators
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US Pat 6,571,628
| Z-axis accelerometer
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US Pat 6,583,501
| Lead frame for an integrated circuit chip (integrated circuit peripheral support)
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US Pat 6,537,411
| Method for low temperature lamination of metals to polyimides
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US Pat 6,540,866
| Method for Lamination of Fluoropolymer to Metal and Print Circuit Board (PCB) Substrate
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US Pat 6,521,447
| Miniaturized thermal cycler
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US Pat 6,509,186
| Miniaturized thermal cycler
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US Pat 6,503,847
| Room temperature wafer-to-wafer bonding by polydimethylsiloxane
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US Pat 6,483,223
| Method to prevent charging effects in electrostatic devices
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US Pat 6,461,888
| Lateral polysilicon beam process
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US Pat 6,432,695
| Miniaturized thermal cycler
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US Pat 6,424,047
| Plastic ball grid array package for passing JEDEC level 1 moisture sensitivity test
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US Pat 6,334,926
| Method for low temperature lamination of metals to fluoropolymers
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US Pat 6,293,148
| Structural design for improving the sensitivity of a surface-micromachined vibratory gyroscope
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US Pat 6,274,650
| Epoxy resin compositions for liquid encapsulation
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US Pat 6,263,740
| CMOS compatible integrated pressure sensor
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US Pat 6,225,140
| CMOS compatible surface machined pressure sensor and method of fabricating the same
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US Pat 6,122,975
| CMOS compatible integrated pressure sensor
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US Pat 6,121,065
| Wafer scale burn-in testing
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US Pat 6,007,728
| Design of a novel tactile sensor
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US Pat 5,967,577
| Apparatus for dispensing fluid in an array pattern
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US Pat 5,930,595
| Isolation process for surface micromachined sensors and actuators
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US Pat 5,925,934
| Low cost and highly reliable chip-sized package
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US Pat 5,893,724
| Method for forming a highly reliable and planar ball grid array package
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US Pat 5,892,290
| Highly reliable and planar ball grid array package
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US Pat 5,836,520
| Apparatus for dispensing fluid in an array pattern
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US Pat
5,773,878
| IC packaging lead frame for reducing chip stress and deformation
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