Triggered by the increasing needs for low-cost, miniaturised, fast and innovative product creation and to broaden the product portfolio of wafer fabs, IME is focusing its micro/nano packaging research and development on 3D stacking, through silicon via (TSV) technology, low-temperature wafer-to-wafer bonding, MEMS, photonics, Cu/ultra low-k devices, embedded wafer level modules, embedded active and passive device in substrate/PCB, electrical, thermal, mechanical design, materials, process and reliability.
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