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IME Signs MOU with Tezzaron to Further Research Collaborations
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 Tezzaron Semiconductor Ltd, a start-up
company specialising in 3D wafer scale
integration, has signed a Memorandum of Understanding with IME to meet
its strategic research demands and to keep its technology competitive.
IME, with its expertise in wafer-to-wafer bonding and
advanced wafer processing facilities, has supported Tezzaron
through various research collaboration projects. These were pivotal to the successful
development and demonstration of Tezzaron’s
patented FaStack™ process technology
which stacks whole semiconductor wafers and creates a very high density
of vertical inter-wafer interconnections.
IME will also assist Tezzaron in
reliability assessment of 3D wafer stacking technology. .
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Dr. Subhash Gupta (left), Managing Director of Tezzaron
at the MOU signing
ceremony with Prof Dim-Lee Kwong,
Executive Director
of IME
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IME and OTCS Embark on RFCMOS Project
 Oki Techno Centre
(Singapore)
Pte Ltd (OTCS) and IME embarked on
furthering their collaboration for the design of RF transceiver using
state of the art RFCMOS process.
IME brings in its expertise in design and modeling for RFCMOS
technology together with OTCS' considerable experience in System and RF IC design and
development for communication applications.
OTCS has collaborated with IME on RFIC designs since 1995,
starting from GaAs and later on moving to CMOS process.
This agreement marks another milestone in IME’s
10-year long history of partnership with OTCS.
Dr Lim Thiam
Beng, Deputy Director (Industry) of IME (left)
at the
signing ceremony with Mr Atsushi Kawai, Managing
Director of OTCS
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 IME Completes WTC2
Project on Cu/low-k Packaging
New approaches in packaging process and
reliability of Cu/low-k devices were explored and studied in the Wafer Technology Consortium (WTC2)
project. Completed recently, the
project demonstrated Cu/low-k packaging processes for 15x15mm wire bonding
and flip chip with good package reliability results.
Two types of packaging – wire bonding
and flipchip packaging – were investigated
with 4 Cu layer/low-k interconnects for lead-free applications. Finally
reliability test vehicles were fabricated, assembled and passed the several
JEDEC standard reliability tests of Pb-free
application.
WTC2
Cu/low-k packaging: Wirebonding BGA package (right) and flipchip
packaging (left)
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 Smoke Sensor
Workshop for Secondary Students
Sixteen
secondary students from Victoria
Junior College, River Valley High School,
Raffles Institution, Hwa Chong
Institution, Raffles Girls’ School and St Gabriel’s Secondary
School spent a fruitful three days of their March school holidays in
IME. They learnt about product
road mapping process, interviewed several IME researchers from different
fields of studies, attended lab tours and analyzed the filter, paper and
tobacco of cigarettes during the workshop conducted by IME researcher Dr.
R. Gopal Krishnan.
No, they were not
taught how to smoke -- as part of a hands-on session,
the students had to conceptualize a smart personal smoke sensing device
in cigarettes to help smokers quit smoking. The students came up with innovative
ideas such as having visual images of their loved ones to appear on the
smokers' mobile phone to remind them not to smoke.
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For further information, contact marketing@ime.a-star.edu.sg
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