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2008 - eFlash
» Issue 05 - November 2008
» Issue 04 - October 2008
» Issue 03 - September 2008
» Issue 02 - August 2008
» Issue 01 - July 2008

2008 - Shortcuts
» IME develops Vertical Silicon-Nanowire Formation and Gate-All-Around MOSFET; IME develops Baseband ASIC Chip for Ultra Low-Power Radio Applications; IME and Finisar to Jointly Develop High-Speed Plastic Optical Fiber (POF) Technology; IME Successful T-Up Collaboration with Addvalue Communications Pte Ltd; IME at 58th Electronic Components and Technology Conference (ECTC 2008); IME Received A*STAR and MTI Borderless Awards
   
» IME Won George E. Smith Award for Si-Based Nanowire Technology;IME and Accent to Jointly Develop Low Power RF Designs;IME Develops Magnetically-Actuated Planar Peristaltic Pump;IME Demonstrates High Performance Ge-on-SOI MSM Photodetector through Schottky Barrier Engineering;IME Develops WLP Technology with Robust Chip Level and Package Level Reliability;Meet the Scientist Talk;Visit by Ngee Ann Students
   
» IME and Cubic Micro Partner on RF Transceiver Blocks; Singapore's First Intelligent Shopping Carts to Adopt IME's RFID Technology; IME Develops Device for Waterborne Pathogen Detection; Schottky Barrier Engineering on Silicon Nanowire Transistors; IME Develops Highly Selective Sensing Technique for DNA Hybridization; IME Establishes Resistive Coupling Efficiency Criterion for Substrate-Shielded On-Chip RF Passives Design; Invited Talk at Silicon Sea Belt Summit; IME Judges at Singapore Science and Engineering Fair; MEMS Lecture and Lab Tour for NUS Students
   
» IME Launches Photonics Prototyping Service; IME and Harvard University Announce Collaboration on Emulsions Research; IME RFID Readers Deployed at Singapore Airshow; IME Presents Paper at ISSCC for Third Year Running; Real Time Monitoring of Cell Adhesion; Breakthrough Study in Gate Dielectric Breakdown; High-Carrier Injection Velocity Silicon-Germanium Nanowire MOSFET
   
» IME-Unisantis Announcement Garners Overwhelming Industry Response; Nanowire Non-Volatile Memory; Development of Burst-mode Transceiver for GPON; Two-axes Scanning MEMS Micromirror Integrated Endoscopic Probe; Low Temperature Wafer Bonding for MEMS Packaging; IME Offers M-STEM Capability; IME Presents Papers at SPIE Conferences; Visit by French Senator; NTU Industrial Attachment Student Poster Presentation

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