Singapore, 2 Jun 2011 - IME's published article in IEEE Transactions on Components and Packaging Technologies emerged from nearly 100 high quality papers to receive the Best Paper Award 2010. The paper titled "Development of 3-D Silicon Module with TSV for System in Packaging" by Navas Khan and team, will be presented with the award at the upcoming 61st Electronics and Technology conference (ECTC) in Florida USA.