Homegrown enterprise, Advanpack Solutions Pte. Ltd. (APS), engages IME in the upgrading of their core packaging technologies under A*STAR T-Up (Technology for Enterprise Upgrading) programme. The T-Up programme aims to help Singapore enterprises upgrade their R&D capabilities through the secondment of experienced researchers as well as to train and build up the R&D human capital in the industry.

APS, dedicated to the development of advanced packaging solutions for the semiconductor industry, has engaged IME in various technology development activities, specifically in the areas of metallurgical studies, packaging design, process/capabilities development and reliability analysis. In the latest T-Up programme with IME, APS has successfully developed an innovative molded interconnect substrate (MIS) and applied to QFN and BGA packaging. The company is currently focused in developing multi-row QFN and fine pitch flip-chip packaging.

Said Mr. Jimmy Chew, CEO of APS, "We would like to take this opportunity to thank IME for having supported APS in the development of new applications for the company's core technologies over the last 2 years. The T-Up programme has enabled us to speed up and achieve significant success in developing MIS and memory flip-chip packages."

APS is very pleased and satisfied with the contributions and performance of the seconded researcher from IME, Mr. Lim Shoa Siong, that they offered him a position in their R&D team. Mr. Lim is now a product & IP manager with APS.

Mr. Lim Shoa Siong, a previous researcher with IME who was scouted by the company engaged in T-Up programme

Originally developed as a solution for fine pitch flip-chip applications, MIS now has a wider range of applications due to its low cost and high design flexibility

APS is in the process of setting up MIS production plants in Singapore and China, which will contribute significantly to the semiconductor industry, especially in the area of fine pitch flip-chip and multi-row QFN packaging. In addition, they will continue to engage IME in the T-Up programme to develop on the applications of MIS in MEMS and optical packaging.