On 20th November 2009, Dr. Rakesh Kumar and Dr. Vaidyanathan Kripesh from IME were invited to speak at an industry session organised by Semiconductor Equipment and Materials International (SEMI) Singapore on MEMS and 3D-TSV research activities. SEMI, the global industry association serving the manufacturing supply chains of the microelectronics, display and photovoltaic industries, presented the market trends to more than 80 attendees, mainly senior executives, from the Singapore semiconductor industry.

Dr. Rakesh Kumar provided an overview of MEMS research at IME, the MEMS market scenario as well as the Singapore MEMS consortium that IME is planning to launch early next year with the support of A*STAR and EDB. IME has been involved in the R&D of MEMS technologies for the last 15 years and has an excellent track record of developing novel MEMS products and transfer of technology to industry. Going forward, IME plans to set up a MEMS consortium early next year in collaboration with companies in MEMS supply chain such as EDA/Design houses, foundries, IDMs, test and assembly houses, materials and equipment suppliers. The objective of the consortium is to promote collaboration among companies for an integrated solution for MEMS manufacturing. The consortium would endeavor to bring in standardization in MEMS design, fabrication and packaging processes to enable manufacturing of MEMS devices for multiple application using common technology platforms. Dr. Kumar also shared that IME has plan to expand its MEMS facility in 2011 and this facility would be made available to industry for prototype fabrication and small volume manufacturing.

Dr. Kumar speaking at SEMI industry session on the MEMS market scenario and the Singapore MEMS consortium that IME will be launching early 2010

Dr. Vaidyanathan Kripesh presented the 3D-TSV research activities in IME as well as Singapore 3D-TSV consortium. He gave an overview of the driving factors for 3D-ICs and its project market value of the next few years and presented the technologies and research focus of IME in these areas. Dr. Kripesh highlighted the salient features of IME's 3D-TSV consortium catered for the local companies funded by A-Star and EDB. He ended the session sharing the establishment of the 12" 3D-TSV line for industry prototyping and stack product demonstrations.