IME Industry Development Manager Mr Tan Teck Chun presented an invited talk on "IME MEMS Packaging Roadmap" at the Silicon Sea Belt Summit, held in Fukuoka, Japan on 26-27 February.

Mr Tan’s presentation covered IME’s current and future work on chip-to-wafer vacuum package technology and low temperature bonding technology development. He also highlighted IME’s packaging capabilities for applications in bio sensor package and MEMS system-in-package.

The Silicon Sea Belt region stretches from South Korea to Japan, China, Taiwan, Hong Kong, Singapore, Malaysia and Bangalore and produces some 50% of the total semiconductor output in the world. Since its start in 2003, the Silicon Sea Belt Summit has been providing proactive information and network opportunities among the participants on industry-academy collaboration, human resource development, market creation and technology development.

IME presented a talk at the Sensor/MEMS workshop at the Silicon Sea Belt Summit 2008.