In today’s fast paced and highly competitive world of microelectronics and nanoelectronics, a timely knowledge of the root cause of change or failure, be it for product or process, is critical.
Advanced analytical and test technology are key enablers in the research and development and fabrication of microelectronics devices. These include materials, and process research and development for a highly competitive manufacturing industry. They are indispensable throughout the entire lifespan of microelectronic products from product development to mass production.
With state-of-the-art equipment, infrastructure and logistics, IME has been supporting the semiconductor industry in Singapore and the region for process monitoring, functional testing, reliability evaluation and wafer process/devices failure analysis (FA) since its inception in 1991. Its industry revenue has grown nearly four times since year 2000.
Over the past five years, IME has analysed nearly 30,000 industrial samples and 40,000 research samples from over 150 companies and institutions respectively. The majority of these companies are wafer fabs, IC designers, packaging and component manufacturers.
IME works closely with these companies to provide solutions-oriented analytical methodologies to solve near and mid term challenges, so as to prevent or reduce their reoccurrence through anticipatory management.
For example, through micro precision surgery by Focused Ion Beam (FIB) and image analysis by high resolution Transmission Electron Microscope (TEM) in nanodefect analysis, semiconductor device engineers are able to fine tune process recipes with crystal clear clarity for defect reduction and yield improvement.
Nano-pillar defects observed in thick GaN film
Analytical research projects with synergistic approach through the application of X-ray Photoelectron Spectroscopy, Auger Electron Spectroscopy, Atomic Force Microscopy and Secondary Ion Mass Spectroscopy have also benefited wafer fabs and package and assembly houses in the analysis of buried layers, subsurface dopants and impurities for early process qualification, adhesion improvement and nanoelectronic analysis literacy.
Device inspection by TEM Other than using IME’s state-of-the-art analytical laboratory and equipment, companies are also able to tap on the expertise of IME’s scientists and engineers who have years of industrial experience in analytical technologies, failure analysis and reliability, material and process characterisation. What sets IME apart from other such service providers internationally is its ability to provide quick turnaround services, within 24 hours if necessary.
One satisfied customer is Dr Hua Younan, Manager of Surface/Advanced Failure Analysis, Chartered Semiconductor Manufacturing. “In today’s competitive environment, accurate and timely FA analysis is extremely important and IME has always been able to render this great support. Chartered FA team sincerely appreciates IME's dedication to good customer service and efficiency of operation,” he commented.
IME is continuously upgrading its infrastructure to ensure that its facilities remain top of the line. It has invested more than $15 million over the past 15 years in its advanced analytical facilities. Its latest addition is the Monochromatic TITAN 300KV Analytical STEM, which has steep measurement capabilities to verify CDs, lithography, front-end processing, interconnect interface integrity as well as for materials and contamination characterisation in sub-micron region. Such state-of-the-art equipment is poised to address packaging and assembly challenges of the local electronic clusters. |
