NANO ELECTRONICS AND PHOTONICS PROGRAM

Scientist - Photonics Packaging

Responsibilities:

• Design and conduct experiments to develop low cost and high-precision processes for R&D and product development for Photonics Devices (e.g. Fiber alignment, Lens align/attach)
• Contribute to specialty laser diode bonding process development, fiber pig-tailing and optical alignment scheme development
• Participate in the development of photonic package from concept to prototype
• Contribute to the development of photonic packaging and assembly capabilities, especially for Silicon Photonics device components

Requirements:

• PhD with at least 5 years of engineering experience
• At least 3 years of hands-on engineering experience in datacom/telecom/aerospace/military industry directly responsible for development, validation and transfer to manufacturing of laser or microelectronics packaging processes for high reliability products that involve free space micro-optics, fiber coupling, die bond, wire bond, & hermetic seal
• Strong hands-on process development skills including DOE, SPC, 6-sigma, troubleshooting, and failure analysis
• Familiar with functionality of micro-optics and suppliers
• Opto-mechanical design experiences would be a plus
• Understanding of device components and system level requirement is preferred

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