We have process competencies for fabrication of Sub 100 nanometer transistors, interconnects technology with copper and low -k dielectrics, test chip design, process simulation, process flow development, as well as wafer level electrical tests.

Our areas of expertise include :

Process Module • Litho module • PVD module • Dielectric module • CMP module • Diffusion module • Etch module • Cleaning module • MEMS process module Process Integration • RF Passives • Transistor base line process • Dual damascene integration
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