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Infrastructure

We have two separate state-of-the–art clean room facilities for 8” wafer processing. The clean rooms house advanced wafer fabrication process equipment for CMOS and MEMS wafer processing. We have a dynamic team of operational, facility and safety personnel dedicated to ensure efficient clean room operation.

Clean room 1 (1500 square meter) is a class 100/10 facility for CMOS compatible devices and MEMS front-end processing

Clean room 2 (400 square meter) is a class 100 facility for MEMS devices and wafer level packaging

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