Prototyping

Cost Structure

Each user will be billed based on cost incurred, which will be computed based on the following considerations :

1. Substrate : This refers to the type of quantity of the SOI wafers required.
2. Mask Area : This refers to the area in units of mm² that is occupied by the user’s design on the photomask. In addition, IME will be charging the associated overhead cost, which includes engineering efforts for mask layout, insertion of designated test structures and alignment marks, as well as consideration with respect to unutilised space on the photomask.
3. Wafer Processing : This refers to the cost pertaining to the fabrication of the designs on silicon, which typically comprises :
   • Processing cost per wafer
   • Processing cost per batch of wafers
   • One-time set up cost for the various processes
   • Metrology cost for post-process measurements
4. Administration : This refers to the administrative costs for carrying out the prototyping runs, which includes shipping, wafer dicing and administrative support.

Cost Structure Table

The following table gives an illustration of the typical costs for a user.