A Subharmonic Up-Conversion Mixer for System-on-Package Application
Millimeterwave applications offer the promise of high-speed and high-performance in short-haul data communications. System-on-package enables a low-cost alternative to move passive components from chip onto package. This paper describes a subharmonic mixer designed on a 3-layer thin-film substrate. The mixer demonstrated low loss in converting intermediate frequency (IF) signals to 273 GHz, thus providing a viable low-cost approach to realise front-end passive components of radiofrequency (RF) transceiver for millimetre-wave applications.... see more
A Thermal Isolation Technique for Three-Dimensional ICs
Heat dissipation is a key challenge in the use of through-silicon-vias (TSV) for realising 3-D integrated circuits (ICs). This paper describes a heat isolation mechanism using a TSV-based guard ring to mitigate against thermal coupling effects. Results demonstrated that the mechanism is feasible for application in highly integrated 3-D ICs in antennas and 3-D stacked memories...see more
Research Highlights
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IME's Statement On Shane Todd’s Case, 18 June 2013 |
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Singapore, 18 June 2013 - The Coroner’s Inquiry (CI) into the death of a former Institute of Microelectronics (IME) employee, Shane Truman Todd, drew to a close with the submission of closing statements by the Attorney-General’s Chambers (AGC) and IME to the State Coroner. The State Coroner will consider the evidence presented and deliver his findings on 8 July 2013.
The closing statements constitute a summation of the evidence presented during the CI, and the AGC and IME’s submissions as to the cause of and circumstances connected with Shane Todd’s death. more
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Seeking a Challenging and Rewarding Career in the area of Microelectronics Research? Exciting career opportunities await you at IME...
We have vacancies for the following
Beside the above mentioned vacancies, we are constantly seeking talented PhD candidates who have a passion for research in the areas of Nano-Electronics, Nano-Photonics, Nano-MEMS, Bio-Electronics, Bio Photonics, Medical Devices, Advanced Packaging, Ultra Low Power, Wireless and High Band Width. Pertinent industry experiences will be an added advantage.
If you feel that you have what it takes to be part of the research scene, we invite you to email us your detailed resume, including expected and current salaries, publications and patents lists.
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