A Thermal Isolation Technique for Three-Dimensional ICs
Heat dissipation is a key challenge in the use of through-silicon-vias (TSV) for realising 3-D integrated circuits (ICs). This paper describes a heat isolation mechanism using a TSV-based guard ring to mitigate against thermal coupling effects. Results demonstrated that the mechanism is feasible for application in highly integrated 3-D ICs present in antennas and 3-D stacked memories... see more
Aluminium Nitride Lamb-Wave Resonators for High Power, High Frequency Applications
Stresses generated during high power applications in market-dominant bulk acoustic wave (BAW) resonators limit their performance in advanced wireless communication systems. This paper describes the design and development of a Lamb-wave resonator. The novel checker-patterned electrode design improves the power-handling capability of the resonator, which can be further scaled up to the desired frequency and output power, paving way for next generation high-power radiofrequency (RF) applications.....see more
Research Highlights
|
IME's Statement On Shane Todd's Case, 14 March 2013 |
|
|
Singapore, 14 March 2013 - The Financial Times (FT) published an article “Death in Singapore” on 15 February 2013 concerning the demise of a former IME researcher Shane Todd. Arising from the FT story, there were many speculative reports in various media concerning the death which were based largely on unverified assumptions and claims. more
|
View Other News...
Institute of Microelectronics Kicks Off Copper Wire Bonding Consortium II To Tackle Copper Interconnects Reliability Issues |
|
|
Singapore, 25 March 2013 -- The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR) in Singapore, has launched the Copper (Cu) Wire Bonding Consortium II. The consortium which rides on the successes of Phase I launched in 2010 aims to improve the reliability of semiconductor devices by tackling copper wire bonding issues related to corrosion and stress. Members of this consortium span across the semiconductor supply chain including Atotech S.E.A., GLOBALFOUNDRIES, Heraeus Materials and Infineon Technologies. more
|
View Other News...
|
Seeking a Challenging and Rewarding Career in the area of Microelectronics Research? Exciting career opportunities await you at IME...
We have vacancies for the following
Beside the above mentioned vacancies, we are constantly seeking talented PhD candidates who have a passion for research in the areas of Nano-Electronics, Nano-Photonics, Nano-MEMS, Bio-Electronics, Bio Photonics, Medical Devices, Advanced Packaging, Ultra Low Power, Wireless and High Band Width. Pertinent industry experiences will be an added advantage.
If you feel that you have what it takes to be part of the research scene, we invite you to email us your detailed resume, including expected and current salaries, publications and patents lists.
|
.jpg)
.jpg)
