A Subharmonic Up-Conversion Mixer for System-on-Package Application
Millimeterwave applications offer the promise of high-speed and high-performance in short-haul data communications. System-on-package enables a low-cost alternative to move passive components from chip onto package. This paper describes a subharmonic mixer designed on a 3-layer thin-film substrate. The mixer demonstrated low loss in converting intermediate frequency (IF) signals to 273 GHz, thus providing a viable low-cost approach to realise front-end passive components of radiofrequency (RF) transceiver for millimetre-wave applications....see more
A Thermal Isolation Technique for Three-Dimensional ICs Heat dissipation is a key challenge in the use of through-silicon-vias (TSV) for realising 3-D integrated circuits (ICs). This paper describes a heat isolation mechanism using a TSV-based guard ring to mitigate against thermal coupling effects. Results demonstrated that the mechanism is feasible for application in highly integrated 3-D ICs in antennas and 3-D stacked memories...see more
Singapore, 18 June 2013 - The Coroner’s Inquiry (CI) into the death of a former Institute of Microelectronics (IME) employee, Shane Truman Todd, drew to a close with the submission of closing statements by the Attorney-General’s Chambers (AGC) and IME to the State Coroner. The State Coroner will consider the evidence presented and deliver his findings on 8 July 2013.
The closing statements constitute a summation of the evidence presented during the CI, and the AGC and IME’s submissions as to the cause of and circumstances connected with Shane Todd’s death. more
Singapore, 30 May 2013 - Imagine being able to download 10 high-definition movies (each of 4 GB capacity) in less than 1 second or be able to enjoy superior lag-free online gaming experience with multiple players from anywhere in the world. Researchers from A*STAR Institute of Microelectronics (IME) have designed and developed a silicon-based optical modulator for ultra fast long-distance telecommunications. more
Singapore 29 May, 2013 -- Singapore’s A*STAR Institute of Microelectronics (IME), Qualcomm Technologies Inc., a wholly owned subsidiary of Qualcomm Incorporated, and STATS ChipPAC have announced a collaboration to develop technology building blocks for Low Cost Interposers (LCI) for 2.5D ICs. more
Singapore, 6 May 2013 – Shikino High-Tech Co., Ltd., a market leader in camera systems and image processing modules, with extensive experience in IP core licensing, has signed a research agreement with A*STAR Institute of Microelectronics (IME) to develop a low power and high performance Gyro-sensor ASIC IP block for commercial hand held applications. more
Singapore, 28 March 2013 - A*STAR’s Institute of Microelectronics (IME) and United Test and Assembly Center (UTAC), a leading outsourced assembly and test (OSAT) provider, have announced a collaboration to develop a 2.5D Through-Silicon-Interposer (TSI) platform which will enable UTAC to join the scarce list of suppliers in offering fine-pitch 2.5D TSI packaging solutions. more
Beside the above mentioned vacancies, we are constantly seeking talented PhD candidates who have a passion for research in the areas of Nano-Electronics, Nano-Photonics, Nano-MEMS, Bio-Electronics, Bio Photonics, Medical Devices, Advanced Packaging, Ultra Low Power, Wireless and High Band Width. Pertinent industry experiences will be an added advantage.
If you feel that you have what it takes to be part of the research scene, we invite you to email us your detailed resume, including expected and current salaries, publications and patents lists.